OTHER Cellphone ICs 23

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SKY65174-21	Skyworks Solutions	RF FRONT END CIRCUIT	OTHER	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-35 Cel		DUAL	S-XDMA-N10		.95 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY13437-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1			2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-35 Cel		QUAD	R-XQMA-N22	3	.9 mm	2.5 mm				260	3.2 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
CC1111F32RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3			Not Qualified	e4	30	260
CC1111F32RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3			Not Qualified	e4	30	260
CC1111F8RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	36	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS		3 V	3	CHIP CARRIER	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3			Not Qualified	e4	30	260
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
TCM4400EPN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.03 mA	3 V	3	FLATPACK	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD	S-PQFP-G80		1.6 mm	12 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12 mm
TCM4400EGGM	Texas Instruments	BASEBAND CIRCUIT	OTHER	BALL	80	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	.03 mA	3 V	3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA80,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-25 Cel		BOTTOM	S-PBGA-B80		1.4 mm	10 mm	Not Qualified				10 mm
TRF4400PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4400PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4710-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4710-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4711-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4711-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4712-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4713-B30-GMR	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4713-B30-GM	Silicon Labs	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD	S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
AD6654BBC	Analog Devices	BASEBAND CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	85 Cel	-25 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B256	3	1.85 mm	17 mm	Not Qualified	e0		240	17 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
SKY13524-639LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	90 Cel	-30 Cel		QUAD	S-XQCC-N14		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
SKY66291-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	16					1			5 V									UNSPECIFIED	S-XXSS-X16	3						260

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.