Analog Devices Cellphone ICs 76

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD6649BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.3 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
ADRF6602ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N40		3	1 mm	6 mm	Not Qualified		e3			6 mm
AD6643BCPZ-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	2		CMOS	.275 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
AD6657ABBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.51 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144		3	1.4 mm	10 mm	Not Qualified		e1	30	260	10 mm
AD6657ABBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			.51 mA	1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144		3	1.4 mm	10 mm	Not Qualified		e1	30	260	10 mm
ADL5363ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N20		3	.9 mm	5 mm			e3			5 mm
AD6672BCPZRL7-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32		3	.8 mm	5 mm	Not Qualified		e3	30	260	5 mm
AD6673BCPZ-250	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	.282 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48		3	.8 mm	7 mm	Not Qualified		e3	30	260	7 mm
AD6673BCPZRL7-250	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	.282 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48		3	.8 mm	7 mm	Not Qualified		e3	30	260	7 mm
ADRF6701ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			BICMOS		5 V	5	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD	S-PQCC-N40					Not Qualified			NOT SPECIFIED	NOT SPECIFIED
ADRF6620ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel		QUAD	S-XQCC-N48			.8 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
AD9361BBCZ-REEL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144		3	1.7 mm	10 mm			e1		260	10 mm
AD9361BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144		3	1.7 mm	10 mm			e1		260	10 mm
ADF7021-NBCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified		e3	30	260	7 mm
AD7002AS	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	1	CMOS	.03 mA	5 V	5	FLATPACK	QFP44,.57SQ,32	Codecs	.8 mm	85 Cel	10	-40 Cel	TIN LEAD	QUAD	S-PQFP-G44	VOLTAGE		2.45 mm	10 mm	Not Qualified	SINGLE-ENDED	e0			10 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel	TIN LEAD	DUAL	R-PDSO-G20		1	2 mm	5.3 mm	Not Qualified		e0		240	7.2 mm
ADF7021BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified		e3	40	260	7 mm
AD6650ABCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	121	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V		GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B121			1.85 mm	12 mm	Not Qualified		e1			12 mm
AD8341ACPZ-REEL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BIPOLAR	.145 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF7021BCPZ-RL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified		e3		260	7 mm
AD6657BBCZRL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144		3	1.4 mm	10 mm	Not Qualified		e1	30	260	10 mm
AD6657BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V	1.8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B144		3	1.4 mm	10 mm	Not Qualified		e1			10 mm
ADL5387ACPZ-WP	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BIPOLAR		5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3		260	4 mm
ADF7020-1BCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified		e3	30	260	7 mm
AD6655ABCPZ-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.805 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
AD6655ABCPZ-80	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.42 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
AD6655ABCPZRL7-125	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.705 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
AD6655ABCPZRL7-150	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.805 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	S-XQCC-N64		3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
ADF4360-9BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-9BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
AD8366ACPZ-R7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	2				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N32		3	1 mm	5 mm	Not Qualified		e3	30	260	5 mm
AD6634BBC	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196		3		15 mm	Not Qualified		e0		240	15 mm
AD6635BB	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.5 V	2.5,3.3	GRID ARRAY	BGA324,18X18,40	Other Telecom ICs	1 mm	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	S-PBGA-B324		3	3.5 mm	19 mm	Not Qualified		e0		225	19 mm
ADF4360-7BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-8BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
AD6636BBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256		3	1.85 mm	17 mm	Not Qualified		e1		260	17 mm
AD6636CBCZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1.8 V		GRID ARRAY			1 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256		3	1.85 mm	17 mm	Not Qualified		e1		260	17 mm
AD8340ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BIPOLAR	.15 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3		260	4 mm
AD8348ARUZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G28		1	1.2 mm	4.4 mm	Not Qualified		e3	30	260	9.7 mm
ADF4360-0BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-0BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-1BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-2BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-3BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-3BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-3BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-4BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm
ADF4360-4BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified		e3	30	260	4 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.