Skyworks Solutions Cellphone ICs 15

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Resolution (um) Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Width Qualification Companding Law Input Type Additional Features Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SE5007BT-R

Skyworks Solutions

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N16

.6 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

SKY65174-21

Skyworks Solutions

RF FRONT END CIRCUIT

OTHER

NO LEAD

10

SQUARE

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

.5 mm

85 Cel

-35 Cel

DUAL

S-XDMA-N10

.95 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

SKY65313-21

Skyworks Solutions

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

28

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

S-XQMA-N28

3

1 mm

6 mm

6 mm

SKY73208-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

MICROELECTRONIC ASSEMBLY

.5 mm

85 Cel

-40 Cel

QUAD

S-XQMA-N36

3

1.45 mm

6 mm

260

6 mm

SKY13437-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

22

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

MICROELECTRONIC ASSEMBLY

.4 mm

90 Cel

-35 Cel

QUAD

R-XQMA-N22

3

.9 mm

2.5 mm

260

3.2 mm

SKY73420-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N36

.9 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

SKY65048-360LF

Skyworks Solutions

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

1

1 mm

2 mm

Not Qualified

e3

260

2 mm

SKY73083-21

Skyworks Solutions

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N36

3

1.15 mm

6 mm

Not Qualified

260

6 mm

SKY78215-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

SKY13524-639LF

Skyworks Solutions

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

14

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

90 Cel

-30 Cel

QUAD

S-XQCC-N14

.5 mm

1.6 mm

NOT SPECIFIED

NOT SPECIFIED

1.6 mm

RFX2411

Skyworks Solutions

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

125 Cel

-40 Cel

QUAD

S-XQCC-N16

.6 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

RFX5000B

Skyworks Solutions

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N16

.6 mm

3 mm

NOT SPECIFIED

NOT SPECIFIED

3 mm

SKY65364-21

Skyworks Solutions

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

28

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

S-XQMA-N28

1 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

SKY66291-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

OTHER

UNSPECIFIED

16

1

5 V

UNSPECIFIED

S-XXSS-X16

3

260

SKY66292-11

Skyworks Solutions

RF AND BASEBAND CIRCUIT

3

260

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.