Texas Instruments Cellphone ICs 127

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TRF4903PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF6903PTRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC1050PWG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
CC1050PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
CC1050PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified		e4	30	260	7.8 mm
CC2420-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC2420-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
TRF6900APTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.05 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	60 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e4	30	260	7 mm
CC2420Z-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified		e4	30	260	7 mm
TRF3702IRHCG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		.17 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
AFE7921IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
AFE7988IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
AFE7989IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
CC1150RGVT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N16	3	1 mm	4 mm			e4	30	260	4 mm
CC1021RSST	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.1536 Mbps	S-PQCC-N32	3	1 mm	7 mm			e4	30	260	7 mm
HPA00420RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm			e4	30	260	4 mm
HPA01083RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm			e4	30	260	4 mm
HPA02142RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4 mA	3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm			e4	30	260	4 mm
HPA00452RSTR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	3	.95 mm	4 mm			e4	30	260	4 mm
HPA00471RSSR	Texas Instruments	RF AND BASEBAND CIRCUIT																			NICKEL PALLADIUM GOLD				3					e4	30	260
HPA00471RUZR	Texas Instruments	RF AND BASEBAND CIRCUIT																			NICKEL PALLADIUM GOLD				3					e4	30	260
ADC31RF80IRMPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1439 mA	1.15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
ADC31RF80IRMP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1439 mA	1.15 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
AFE7799IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
AFE7920IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
CC1260RGZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
CC1260RGZT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
AFE7700IALK	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e0	20	220	17 mm
AFE8030IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE8030EDIABJ	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
AFE8030EDIALK	Texas Instruments	RF AND BASEBAND CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32		.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm		RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e0		220	17 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.