Cellphone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BGA7350,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
BGU7060Y	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
BGU7061,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16	3	1.4 mm	8 mm				260	8 mm
BGU7062,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		1.4 mm	8 mm					8 mm
BGU7063,115	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16		1.4 mm	8 mm					8 mm
BGU7063,518	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG		1.42 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N16	3	1.4 mm	8 mm			30	260	8 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V	SMALL OUTLINE		1.37 mm			TIN	DUAL		R-PDSO-G16	3	3.6 mm	11 mm		e3	30	245	15.9 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				28 V	SMALL OUTLINE		1.37 mm			Tin (Sn)	DUAL		R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
CC1150RGVT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.5 Mbps	S-PQCC-N16	3	1 mm	4 mm		e4	30	260	4 mm
CC1021RSST	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.1536 Mbps	S-PQCC-N32	3	1 mm	7 mm		e4	30	260	7 mm
STA8088TGATR	STMicroelectronics	RF AND BASEBAND CIRCUIT																		MATTE TIN				3				e3	40	260
SKY13524-639LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	90 Cel	-30 Cel		QUAD		S-XQCC-N14		.5 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
HMC832ALP6GETR	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N40	1	.9 mm	6 mm		e3	30	260	6 mm
HMC832ALP6GE	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N40	1	.9 mm	6 mm		e3	30	260	6 mm
RFX2411	Skyworks Solutions	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
RFX5000B	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
SKY65364-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28		SQUARE	UNSPECIFIED	YES	1				3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		QUAD		S-XQMA-N28		1 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
ST25R3912-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
AD6688BBPZRL-3000	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				.975 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.53 mm	12 mm			30	260	12 mm
SKY66291-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	UNSPECIFIED	16					1				5 V							UNSPECIFIED		S-XXSS-X16	3						260
SKY66292-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT																						3						260
HPA00420RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
HPA01083RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
HPA02142RGVR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			4 mA	3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	4 mm		e4	30	260	4 mm
HPA00452RSTR	Texas Instruments	RF AND BASEBAND CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	3	.95 mm	4 mm		e4	30	260	4 mm
HPA00471RSSR	Texas Instruments	RF AND BASEBAND CIRCUIT																		NICKEL PALLADIUM GOLD				3				e4	30	260
HPA00471RUZR	Texas Instruments	RF AND BASEBAND CIRCUIT																		NICKEL PALLADIUM GOLD				3				e4	30	260
J-N3-B3E6-LR	Telit Communications Plc	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N24		2.4 mm	12.2 mm					16 mm
ADC31RF80IRMPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1439 mA	1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ADC31RF80IRMP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1439 mA	1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N72	3	.9 mm	10 mm		e4	30	260	10 mm
ST25R3913-AQFT	STMicroelectronics	RF AND BASEBAND CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N32		1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
A2I25H060GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS			28 V	SMALL OUTLINE, HEAT SINK/SLUG					TIN	DUAL		R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
A2I25H060NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS			28 V	SMALL OUTLINE, HEAT SINK/SLUG					TIN	DUAL		R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
MHT2001NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																		TIN				3				e3	40	260
AFE7799IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
ADRF5545ABCPZN	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
LARA-R202-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.8 V	GRID ARRAY	LGA100(UNSPEC)		65 Cel	-20 Cel		BOTTOM		R-XLGA-N100	4	2.87 mm	24 mm	-40 to 85 extended operating temp available			245	26 mm
AFSC5G26D37T2	NXP Semiconductors	RF AND BASEBAND CIRCUIT																		NICKEL GOLD				3				e4	40	260
MWPR1124ZVHT	NXP Semiconductors	RF AND BASEBAND CIRCUIT																		NICKEL GOLD				3				e4	40	260
ADRF5549BCPZN	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADRF5547BCPZN	Analog Devices	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N40	3	1 mm	6 mm			30	260	6 mm
S2-LPTXQTR	STMicroelectronics	RF AND BASEBAND CIRCUIT		NO LEAD	24	HVQCCN	SQUARE		YES	1				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N24		1 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
LX5584BLQ-TR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N16		1.023 mm	3 mm					3 mm
AFE7920IABJ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000	e1	30	260	17 mm
A3I25X050NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT																		TIN				3				e3	40	260
ADRF6650ACPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
ADRF6650ACPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
SARA-R410M-63B	U-blox Ag	RF AND BASEBAND CIRCUIT																						4

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.