COMMERCIAL Digital Transmission Controllers 18

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Maximum Supply Current Nominal Supply Voltage Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Output High Voltage Maximum Output Low Voltage Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Reference Point Moisture Sensitivity Level (MSL) Maximum Seated Height Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TP3404V/63SN

Texas Instruments

TIME SLOT ASSIGNER

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5 V

5

BASIC

CHIP CARRIER

LDCC28,.5SQ

Digital Transmission Interfaces

1.27 mm

70 Cel

2.4 V

.4 V

0 Cel

MATTE TIN

QUAD

.144 Mbps

S-PQCC-J28

U

2A

Not Qualified

1 Amp

e3

30

245

DS26522G

Maxim Integrated

TIME SLOT 0/16 TRANSCEIVER

COMMERCIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.22 mA

3.3 V

3.3

GRID ARRAY

BGA144,12X12,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B144

3

1.75 mm

T-1(DS1)

CEPT PCM-30/E-1

13 mm

Not Qualified

13 mm

DS26504L

Maxim Integrated

FRAMER

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

.15 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.6 mm

T-1(DS1)

CEPT PCM-30/E-1

10 mm

Not Qualified

e0

10 mm

DS26524G

Maxim Integrated

TIME SLOT 0/16 TRANSCEIVER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.45 mA

3.3 V

3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

1.76 mm

T-1(DS1)

CEPT PCM-30/E-1

17 mm

Not Qualified

e0

17 mm

DS2154LA2

Maxim Integrated

FRAMER

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e0

245

14 mm

DS2154LD1

Maxim Integrated

FRAMER

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G100

3

1.6 mm

CEPT PCM-30/E-1

14 mm

Not Qualified

e0

245

14 mm

DS2154LD2

Maxim Integrated

FRAMER

COMMERCIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e0

245

14 mm

DS3112D1

Maxim Integrated

FRAMER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B256

3

2.34 mm

27 mm

Not Qualified

27 mm

DS2155GB

Maxim Integrated

FRAMER

COMMERCIAL

BALL

100

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

GRID ARRAY, FINE PITCH

BGA100,10X10,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B100

1

T-1(DS1)

CEPT PCM-30/E-1

10 mm

Not Qualified

10 mm

DS26528

Maxim Integrated

FRAMER

COMMERCIAL

BALL

256

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, HEAT SINK/SLUG

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B256

3

1.76 mm

17 mm

Not Qualified

17 mm

DS3170

Maxim Integrated

FRAMER

COMMERCIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

.145 mA

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B100

3

1.5 mm

11 mm

Not Qualified

e0

11 mm

DS3172

Maxim Integrated

FRAMER

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.328 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS3173

Maxim Integrated

FRAMER

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.449 mA

3.3 V

3.3

GRID ARRAY

BGA400,20X20,50

Other Telecom ICs

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B400

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS26502L

Maxim Integrated

FRAMER

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

.15 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.6 mm

T-1(DS1)

CEPT PCM-30/E-1

10 mm

Not Qualified

e0

10 mm

DS26503L

Maxim Integrated

FRAMER

COMMERCIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

.15 mA

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN LEAD

QUAD

S-PQFP-G64

3

1.6 mm

T-1(DS1)

CEPT PCM-30/E-1

10 mm

Not Qualified

e0

10 mm

DS26556

Maxim Integrated

FRAMER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B256

3

1.76 mm

T-1(DS1)

CEPT PCM-30/E-1

17 mm

Not Qualified

245

17 mm

DS2156G

Maxim Integrated

FRAMER

COMMERCIAL

BALL

100

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

GRID ARRAY, FINE PITCH

BGA100,10X10,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B100

3

T-1(DS1)

CEPT PCM-30/E-1

10 mm

Not Qualified

e0

10 mm

DS26528G

Maxim Integrated

FRAMER

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.875 mA

3.3 V

3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

3

1.76 mm

T-1(DS1)

CEPT PCM-30/E-1

17 mm

Not Qualified

e0

17 mm

Digital Transmission Controllers

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.