CAN FD TRANSCEIVER Network Interfaces 45

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

MCP2561FD-H/P

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TS 16949

1

70 mA

5 V

IN-LINE

DIP8,.3

2.54 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

R-PDIP-T8

5.334 mm

7.62 mm

e3

9.271 mm

MCP2561FDT-H/MF

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1

70 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

S-PDSO-N8

1

1 mm

3 mm

e3

40

260

3 mm

MCP2561FDT-H/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

1

70 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

e3

4.9 mm

MCP2562FD-H/P

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TS 16949

1

70 mA

5 V

IN-LINE

DIP8,.3

2.54 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

R-PDIP-T8

5.334 mm

7.62 mm

e3

9.271 mm

NCV7344AD13R2G

Onsemi

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

70 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

5 Mbps

R-PDSO-G8

2

1.75 mm

4.9 mm

e3

30

260

6 mm

TCAN1043ADRQ1

Texas Instruments

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

110 mA

5 V

SMALL OUTLINE

SOP14,.25

1.27 mm

150 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

8 Mbps

R-PDSO-G14

1

1.75 mm

3.9 mm

e4

30

260

8.65 mm

ATA6566-GAQW1-VAO

Microchip Technology

CAN FD TRANSCEIVER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

85 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

ATA6566-GBQW0-VAO

Microchip Technology

CAN FD TRANSCEIVER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

85 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

DUAL

S-PDSO-N8

.9 mm

3 mm

3 mm

ATA6566-GBQW1-VAO

Microchip Technology

CAN FD TRANSCEIVER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

85 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

125 Cel

-40 Cel

DUAL

S-PDSO-N8

.9 mm

3 mm

3 mm

ATA6562-GAQW1-VAO

Microchip Technology

CAN FD TRANSCEIVER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100;AEC-Q006

1

85 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

4.9 mm

3.9 mm

ATA6563-GBQW1-VAO

Microchip Technology

CAN FD TRANSCEIVER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100;AEC-Q006

1

85 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

125 Cel

-40 Cel

DUAL

S-PDSO-N8

.9 mm

3 mm

3 mm

MCP2542WFDT-E/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

140 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

125 Cel

-40 Cel

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

MCP2542WFDT-H/MF

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

140 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

S-PDSO-N8

1 mm

3 mm

e3

30

260

3 mm

MCP2542WFDT-H/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

140 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

MCP2544FDT-H/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

140 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

e3

4.9 mm

MCP2544WFDT-H/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

140 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

MCP2557FDT-H/MF

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1

70 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

S-PDSO-N8

1 mm

3 mm

e3

3 mm

MCP2557FDT-H/SN

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

1

70 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

MATTE TIN

DUAL

8 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

e3

4.9 mm

ATA6570-GNQW1

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

1

1.5 mA

13 V

SMALL OUTLINE

SOP14,.25

1.27 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

5 Mbps

R-PDSO-G14

1.75 mm

3.9 mm

Also Operates as CAN Transceiver with data rate up to 1000kbps

e3

8.65 mm

ATA6566-GAQW0

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

85 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

DUAL

2 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

ATA6566-GAQW1

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

85 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

125 Cel

-40 Cel

DUAL

2 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

ATA6566-GBQW1

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

85 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

125 Cel

-40 Cel

DUAL

2 Mbps

S-PDSO-N8

1 mm

3 mm

3 mm

ATA6566-GBQW0

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

85 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

DUAL

2 Mbps

S-PDSO-N8

1 mm

3 mm

3 mm

TLE92613QXV33XUMA1

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

150 Cel

-40 Cel

QUAD

.5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9261QXV33XUMA1

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

150 Cel

-40 Cel

QUAD

5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE92613BQXV33XUMA1

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

150 Cel

-40 Cel

QUAD

5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9261BQXXUMA1

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

150 Cel

-40 Cel

QUAD

5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE92603QXXUMA1

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

2 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9261QXXUMA2

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

2 Mbps

S-PQCC-N48

3

.9 mm

7 mm

7 mm

UJA1169TKZ

NXP Semiconductors

CAN FD TRANSCEIVER

NO LEAD

20

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

7.5 mA

13 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC20,.15,20

.5 mm

NICKEL PALLADIUM GOLD SILVER

DUAL

2 Mbps

R-PDSO-N20

1

1 mm

3.5 mm

e4

30

260

5.5 mm

TLE9271QXV33XUMA1

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

10 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

150 Cel

-40 Cel

TIN

QUAD

5 Mbps

S-PQCC-N48

3

.9 mm

7 mm

e3

7 mm

ATA6560-GAQW-VAO

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

70 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

DUAL

5 Mbps

R-PDSO-G8

1.75 mm

3.9 mm

4.9 mm

ATA6560-GBQW-VAO

Microchip Technology

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

70 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

DUAL

5 Mbps

S-PDSO-N8

1 mm

3 mm

3 mm

TCAN1146DMTRQ1

Texas Instruments

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

120 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC14,.12,25

.65 mm

150 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

5 Mbps

S-PDSO-N14

2

1 mm

3 mm

e4

30

260

4.5 mm

UJA1169ATK/F/3

NXP Semiconductors

CAN FD TRANSCEIVER

NO LEAD

20

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

67 mA

13 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC20,.14,20

.5 mm

DUAL

15 Mbps

R-PDSO-N20

1 mm

3.5 mm

5.5 mm

TCAN1057AVDRBRQ1

Texas Instruments

CAN FD TRANSCEIVER

AUTOMOTIVE

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

130 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

8 Mbps

S-PDSO-N8

2

1 mm

3 mm

ESD for CANH, CANL pins is 3B

e4

260

3 mm

TCAN1044ADRBRQ1

Texas Instruments

CAN FD TRANSCEIVER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

130 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

150 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

8 Mbps

S-PDSO-N8

2

1 mm

3 mm

ESD Value for CANH, CANL wrt GND is 3B

e4

260

3 mm

ISOW1044DFMR

Texas Instruments

CAN FD TRANSCEIVER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

1

136 mA

5 V

SMALL OUTLINE

SOP20,.4

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

5 Mbps

R-PDSO-G20

3

3.55 mm

7.5 mm

e4

260

12.83 mm

TCAN1462VDRBRQ1

Texas Instruments

CAN FD TRANSCEIVER

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

AEC-Q100

1

130 mA

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.12,25

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

8 Mbps

S-PDSO-N8

2

1 mm

3 mm

e4

30

260

3 mm

TLE9251SJXUMA1

Infineon Technologies

CAN FD TRANSCEIVER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100

1

48 mA

5 V

SMALL OUTLINE

SOP8,.25

1.27 mm

150 Cel

-40 Cel

NICKEL GOLD PALLADIUM

DUAL

5 Mbps

R-PDSO-G8

2A

1.73 mm

3.94 mm

4.93 mm

TLE9272QXV33XUMA2

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

10 mA

6.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9271QXV33XUMA2

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

10 mA

6.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9261BQXV33XUMA2

Infineon Technologies

CAN FD TRANSCEIVER

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1

6.5 mA

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

150 Cel

-40 Cel

QUAD

5 Mbps

S-PQCC-N48

.9 mm

7 mm

7 mm

MC33665ATS4AE

NXP Semiconductors

CAN FD TRANSCEIVER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

FLATPACK

125 Cel

-40 Cel

QUAD

10 Mbps

S-PQFP-G48

3

40

260

MC33665ATU4AE

NXP Semiconductors

CAN FD TRANSCEIVER

GULL WING

48

QFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1

FLATPACK

125 Cel

-40 Cel

QUAD

10 Mbps

S-PQFP-G48

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.