| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
10 mm |
||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
24 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
4 |
AEC-Q100 |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.02 Mbps |
R-PQCC-N24 |
2 |
1 mm |
3.5 mm |
e3 |
30 |
260 |
5.5 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
2.794 mm |
7.493 mm |
e3 |
15.875 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
GRID ARRAY, LOW PROFILE |
BGA144,12X12,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
.00001 Mbps |
S-PBGA-B144 |
1.4 mm |
13 mm |
13 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1130 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
800 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1890 mA |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1890 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
e1 |
17 mm |
|||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1.2 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
100 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
2 mm |
17 mm |
e1 |
17 mm |
||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
132 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N132 |
3 |
.9 mm |
10 mm |
10 mm |
|||||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
85 Cel |
-45 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
TMII MODE SUPPORTS 200 MBPS DATA RATE |
28 mm |
||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
TMII MODE SUPPORTS 200 MBPS DATA RATE |
28 mm |
||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
812 mA |
1.2 V |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B256 |
3 |
1.7 mm |
17 mm |
17 mm |
|||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
28 mm |
||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
7 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
ALSO REQUIRE 3.3V SUPPLY |
28 mm |
|||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
212 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
-45 Cel |
BOTTOM |
S-PBGA-B212 |
3 |
1.017 mm |
11 mm |
11 mm |
|||||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
6 |
290 mA |
1.8 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
20 mm |
|||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
6 |
290 mA |
1.8 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
20 mm |
|||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
24 |
1450 mA |
1.2 V |
GRID ARRAY |
BGA400,20X20,50 |
1.27 mm |
85 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PBGA-B400 |
2.33 mm |
27 mm |
27 mm |
|||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
24 |
1450 mA |
1.2 V |
GRID ARRAY |
BGA400,20X20,50 |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PBGA-B400 |
3 |
2.33 mm |
27 mm |
27 mm |
|||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
186 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
BGA186(UNSPEC) |
BOTTOM |
S-PBGA-B186 |
3 |
||||||||||||||||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,16 |
.4 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-PQCC-N64 |
.9 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-PQCC-N64 |
.9 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC64,.32SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-PQCC-N64 |
.9 mm |
8 mm |
e3 |
30 |
260 |
8 mm |
||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
256 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
GRID ARRAY |
70 Cel |
0 Cel |
BOTTOM |
R-PBGA-B256 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B256 |
e1 |
255 |
|||||||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
|
Analog Devices |
ETHERNET TRANSCEIVER |
BALL |
194 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
BGA194,17X17,87 |
2.2 mm |
85 Cel |
-40 Cel |
BOTTOM |
100 Mbps |
S-PBGA-B194 |
3.56 mm |
38 mm |
NOT SPECIFIED |
NOT SPECIFIED |
38 mm |
||||||||||||||||
|
|
Maxim Integrated |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
-9 V |
1 |
.065 mA |
9 V |
+-9 |
IN-LINE |
LDCC28,.5SQ |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T28 |
3 |
4.191 mm |
10.16 mm |
Not Qualified |
11.54 mm |
||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
1.1 mm |
6.1 mm |
260 |
11 mm |
||||||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
1.1 mm |
6.1 mm |
260 |
11 mm |
||||||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-G32 |
3 |
1.1 mm |
6.1 mm |
e4 |
30 |
260 |
11 mm |
||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
1.1 mm |
6.1 mm |
260 |
11 mm |
|||||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
32 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
R-PDSO-G32 |
3 |
1.1 mm |
6.1 mm |
e4 |
30 |
260 |
11 mm |
||||||||||||||
|
|
NXP Semiconductors |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
24 |
HTSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G24 |
3 |
1.1 mm |
6.1 mm |
260 |
11 mm |
||||||||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N56 |
1 mm |
8 mm |
e3 |
8 mm |
|||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N56 |
1 mm |
8 mm |
e3 |
8 mm |
|||||||||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
||||||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
AEC-Q100 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
100000 Mbps |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
|||||||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
47 |
RECTANGULAR |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
R-XXMA-N47 |
3.34 mm |
17.78 mm |
26.67 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.