INTERFACE CIRCUIT Network Interfaces 285

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NTS0101GW,125	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G6	1	1.1 mm	1.25 mm	e3	30	260	2 mm
TCAN330DCNT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.45 mm	1.6 mm	e4	30	260	2.9 mm
TCAN330GDCNT	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-G8	1	1.45 mm	1.6 mm	e4	30	260	2.9 mm
TCAN334D	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	e4	30	260	4.9 mm
TCAN337D	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1					3.3 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	e4	30	260	4.9 mm
TCAN1051HVDQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE		1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm	e4	NOT SPECIFIED	260	4.905 mm
TCAN1051VDQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE		1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm	e4	NOT SPECIFIED	260	4.905 mm
MC34CM3120EPR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	5 mm				5 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm	e1	30	260	12 mm
AD9371BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm	e1	30	260	12 mm
AD9375BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		30	260	12 mm
AD9375BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		30	260	12 mm
TCAN1051DRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051GDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051GDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051HDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051HDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051HGDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051HGVDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	5 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051HVDRBRQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TCAN1051HVDRBTQ1	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	180 mA	5 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-55 Cel	MATTE TIN	DUAL	2 Mbps	S-PDSO-N8	1	1 mm	3 mm	e3	30	260	3 mm
TLE72592GEXUMA4	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			8 V	SMALL OUTLINE		1.27 mm			TIN	DUAL		R-PDSO-G8	2A	1.73 mm	3.94 mm	e3			4.93 mm
HVD233HKX/EM	Texas Instruments	INTERFACE CIRCUIT		FLAT	8	DFP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	YES	1	1				6 mA	3.3 V	FLATPACK		1.27 mm			NICKEL GOLD	DUAL	1 Mbps	R-CDFP-F8		2.785 mm	6.475 mm	e4			6.485 mm
TLIN1022DMTRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100			24 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e4	30	260	4.5 mm
TLIN1022DMTTQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100			24 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e4	30	260	4.5 mm
TLIN2022DMTTQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100			24 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-N14	2	.9 mm	3 mm	e4	30	260	4.5 mm
TLE7250GXUMA2	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm				DUAL		R-PDSO-G8	2A	1.75 mm	4 mm		NOT SPECIFIED	NOT SPECIFIED	5 mm
TLE8250SJXUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm			NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	2A	1.75 mm	4 mm				5 mm
TLE8250VSJXUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm			NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	2A	1.75 mm	4 mm				5 mm
TLE9255WSKXUMA1	Infineon Technologies	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE		1.27 mm				DUAL		R-PDSO-G14		1.75 mm	4 mm		NOT SPECIFIED	NOT SPECIFIED	8.75 mm
IFX1051LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1						5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm	125 Cel	-40 Cel	TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3		260	3 mm
IFX1051SJXUMA1	Infineon Technologies	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL		R-PDSO-G8	2A	1.75 mm	4 mm			260	5 mm
TLE7250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
TLE7250XLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE		.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm	e3			3 mm
AX-SFJK-1-01-TB05	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm	e4		260	7 mm
NCV7429DE5R2G	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	2	1.1 mm	4.4 mm	e3	30	260	6.5 mm
MC35FS4500CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		SMARTMOS	AEC-Q100	1			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm		40	260	7 mm
TJA1083GTT/0Z	NXP Semiconductors	INTERFACE CIRCUIT																				NICKEL PALLADIUM GOLD SILVER				1			e4	30	260
ISO1042BQDWQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			1.8 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	2.65 mm	7.5 mm	e4	30	260	10.3 mm
ADM3050ETRWZ-EP	Analog Devices	INTERFACE CIRCUIT	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V	SMALL OUTLINE		1.27 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	2.65 mm	7.5 mm	e4		260	10.3 mm
TLIN10285DRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	300 mA	12 V	SMALL OUTLINE		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.02 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm	e4	30	260	4.905 mm
TJA1022HGZ	NXP Semiconductors	INTERFACE CIRCUIT																				NICKEL PALLADIUM GOLD SILVER				1			e4	30	260
TLE9272QXV33XUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm	e3			7 mm
TLE9271QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm	e3			7 mm
TUSB2E22YCGR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2					1.8 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16	.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm		30	260	2 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.