SUPPORT CIRCUIT Network Interfaces 22

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

TJF1051T/3,112

NXP Semiconductors

SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.07 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

SN65HVD101RGBR

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 mA

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

R-PQCC-N20

2

1 mm

3.5 mm

e4

NOT SPECIFIED

260

4 mm

SN65HVD102RGBR

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2 mA

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

R-PQCC-N20

2

1 mm

3.5 mm

e4

NOT SPECIFIED

260

4 mm

TLK10034AAJ

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

4

1249 mA

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

10000 Mbps

S-PBGA-B324

4

3.29 mm

19 mm

e1

30

260

19 mm

DS33Z11

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

3

1.5 mm

14 mm

Not Qualified

14 mm

DS33ZH11

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

100

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

10 mm

Not Qualified

e1

225

10 mm

PN5331B3HN/C270,51

NXP Semiconductors

SUPPORT CIRCUIT

OTHER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

2

1 mm

6 mm

Not Qualified

e4

260

6 mm

NB4N7132DTG

Onsemi

SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.125 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

TLK3114SAGNT

Texas Instruments

SUPPORT CIRCUIT

COMMERCIAL

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

1.5/2.5,2.5

GRID ARRAY

BGA289,17X17,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B289

2 mm

19 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

19 mm

TLK3114SBGNT

Texas Instruments

SUPPORT CIRCUIT

COMMERCIAL

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

1.5/2.5,2.5

GRID ARRAY

BGA289,17X17,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B289

2 mm

19 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

19 mm

STULPI01ATBR

STMicroelectronics

SUPPORT CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B36

3

1.16 mm

3.6 mm

Not Qualified

e1

30

260

3.6 mm

MAX2829ETN

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

8 mm

TLE9254LCXUMA1

Infineon Technologies

SUPPORT CIRCUIT

Tin (Sn)

2A

e3

NOT SPECIFIED

NOT SPECIFIED

TLK10031CTR

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

700 mA

1 V

GRID ARRAY

BGA144,12X12,40

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

10312.5 Mbps

S-PBGA-B144

4

3.25 mm

13 mm

Not Qualified

e1

30

260

13 mm

TJF1051T/3/1U

NXP Semiconductors

SUPPORT CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-G8

1

1.75 mm

3.9 mm

e4

30

260

4.9 mm

TJF1051T/3/CM,118

NXP Semiconductors

SUPPORT CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

70 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

125 Cel

-40 Cel

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

30

260

4.9 mm

BCM53134SKFBG

Broadcom

SUPPORT CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

BOTTOM

S-PBGA-B256

3

260

BCM53112MB0ILFBG

Broadcom

SUPPORT CIRCUIT

INDUSTRIAL

UNSPECIFIED

SQUARE

UNSPECIFIED

1

85 Cel

-40 Cel

BCM56450B1IFSBG

Broadcom

SUPPORT CIRCUIT

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

1

CMOS

UNSPECIFIED

102500 Mbps

X-XXSS-X

4

245

BCM88370CB0KFSBG

Broadcom

SUPPORT CIRCUIT

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

1

UNSPECIFIED

800000 Mbps

X-XXSS-X

4

245

BCM88680CA1KFSBG

Broadcom

SUPPORT CIRCUIT

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

1

UNSPECIFIED

900000 Mbps

X-XXSS-X

WIZ810MJ

Wiznet

SUPPORT CIRCUIT

THROUGH-HOLE

56

QMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

2 mm

85 Cel

-40 Cel

QUAD

R-XQMA-T56

25 mm

48 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.