COMMERCIAL Network Interfaces 48

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DP83849CVSX/NOPB	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			4		3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G80	3	1.2 mm	12 mm			e4	30	260	12 mm
DP83910AV/63SN	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					4		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-J28	2A	4.57 mm	11.43 mm			e3	30	245	11.43 mm
TMS38054PAH	Texas Instruments	TOKEN RING TRANSCEIVER	COMMERCIAL	GULL WING	52	TQFP	SQUARE	PLASTIC/EPOXY	YES	1						200 mA	5 V		FLATPACK, THIN PROFILE			.65 mm	70 Cel	0 Cel		QUAD		S-PQFP-G52		1.2 mm	10 mm	Not Qualified					10 mm
DP8392CN-1	National Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				-9 V	1	.18 mA		-9	IN-LINE	DIP16,.3	Network Interfaces	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDIP-T16		5.08 mm	7.62 mm	Not Qualified		e0			19.305 mm
V23818-K305-L17	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1							3.3 V		FIBER OPTIC				70 Cel	0 Cel		UNSPECIFIED		R-XXFO-X				Not Qualified
V23818-K305-L57	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1							3.3 V		FIBER OPTIC				70 Cel	0 Cel		UNSPECIFIED		R-XXFO-X				Not Qualified
V23818-M305-L57	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1							3.3 V		FIBER OPTIC				70 Cel	0 Cel		UNSPECIFIED		R-XXFO-X				Not Qualified
TMS38054FNL	Texas Instruments	TOKEN RING TRANSCEIVER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					1	.2 mA	5 V	5	CHIP CARRIER	LDCC44,.7SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel		QUAD	16 Mbps	S-PQCC-J44		4.57 mm	16.5862 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	16.5862 mm
TMS38054PBGL	Texas Instruments	TOKEN RING TRANSCEIVER	COMMERCIAL	GULL WING	52	QFP	SQUARE	PLASTIC/EPOXY	YES	1							5 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD		S-PQFP-G52		1.2 mm	10 mm	Not Qualified					10 mm
PX1012A-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified		e1			9 mm
PX1011A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified		e1			9 mm
PX1011A-EL1:557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	1	1.6 mm	9 mm	Not Qualified					9 mm
PX1011B-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				260	9 mm
PX1011B-EL1/N,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified					9 mm
PX1012A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified		e1			9 mm
KSZ8051MLL	Micrel	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					1		1.2 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	7 mm
TLK3114SAGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK2208GPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			8		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	1300 Mbps	S-PBGA-B289		2 mm	19 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK3114SBGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	19 mm
TNETE2201BPJWG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.26 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.63SQ,32	Network Interfaces	.5 mm	70 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified		e4	NOT SPECIFIED	260	10 mm
TNETE2201BPJWRG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.26 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.55SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2201BRCPR	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TNETE2201BPJDRG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.26 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified		e4	30	260	10 mm
DLKPC192SGNT	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					1.8 V	1.8,2.5,3.3	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified					19 mm
TLK2201BRCPRG4	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	70 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	NOT SPECIFIED	260	10 mm
BCM5387KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				812 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B256	3	1.7 mm	17 mm						17 mm
BCM53118KQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm						28 mm
BCM53128VKQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			7		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	70 Cel	0 Cel		QUAD	100 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		ALSO REQUIRE 3.3V SUPPLY				28 mm
BCM5325FKQMG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			6	290 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel		QUAD	100 Mbps	R-PQFP-G128	3	3.4 mm	14 mm						20 mm
BCM53242MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			24	1450 mA	1.2 V		GRID ARRAY	BGA400,20X20,50		1.27 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PBGA-B400	3	2.33 mm	27 mm						27 mm
KSZ9131MNXC-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
TUSB2E22YCGT	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm				30	260	2 mm
BCM54140B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			4				GRID ARRAY				70 Cel	0 Cel		BOTTOM		R-PBGA-B256							NOT SPECIFIED	NOT SPECIFIED
78Q8392LA03-CHR/F	Maxim Integrated	ETHERNET TRANSCEIVER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		BICMOS		-9 V	1	.065 mA	9 V	+-9	IN-LINE	LDCC28,.5SQ	Network Interfaces	2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T28	3	4.191 mm	10.16 mm	Not Qualified					11.54 mm
LAN8820-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949		1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm			e3			8 mm
KSZ9897STXC	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G128		1.2 mm	14 mm			e3			14 mm
BCM53101PKMLG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	132	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS					1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N132	3	.9 mm	10 mm						10 mm
BCM53134MKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
BCM53158XUB1KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	311	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1							1 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B311	3	1.337 mm	13 mm			e1			13 mm
BCM53106OKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
BCM53106SKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
BCM53134PKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
TUSB2E22YCGR	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2						1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm				30	260	2 mm
KSZ8051MNL-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32		.9 mm	5 mm			e4			5 mm
KSZ9021GN-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949		1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1000 Mbps	S-XQCC-N64	3	.9 mm	8 mm			e4	30	260	8 mm
BCM54185B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			8				GRID ARRAY				70 Cel	0 Cel		BOTTOM		R-PBGA-B400
BCM54180B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			8				GRID ARRAY				70 Cel	0 Cel		BOTTOM		R-PBGA-B400
BCM54182B0KQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	128	QCCN	RECTANGULAR	UNSPECIFIED	YES	1		CMOS			8				CHIP CARRIER				70 Cel	0 Cel		QUAD		R-XQCC-N128

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.