BALL Network Interfaces 94

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM5464SA1IRB	Broadcom	ETHERNET TRANSCEIVER		BALL	354	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS						GRID ARRAY							BOTTOM	1000 Mbps	R-PBGA-B354
UPD60510F1-HN4-M1-A	Renesas Electronics		INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES							3.3 V	3.3	GRID ARRAY	BGA324,18X18,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN BISMUTH	BOTTOM		S-PBGA-B324				Not Qualified	e6
MC-10287F1-HN4-M1-A	Renesas Electronics		INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES							3.3 V	3.3	GRID ARRAY	BGA324,18X18,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN BISMUTH	BOTTOM		S-PBGA-B324				Not Qualified	e6
TLK10034AAJ	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		4	1249 mA	1 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B324	4	3.29 mm	19 mm		e1	30	260	19 mm
BCM5388KPB	Broadcom	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.2 V		GRID ARRAY							BOTTOM		S-PBGA-B324						NOT SPECIFIED	NOT SPECIFIED
BCM5464A1KRBG	Broadcom	ETHERNET TRANSCEIVER		BALL	354	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1		CMOS						GRID ARRAY							BOTTOM		X-PBGA-B354						NOT SPECIFIED	NOT SPECIFIED
BCM5466SRA0KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	256	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1		CMOS						GRID ARRAY							BOTTOM		X-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
BCM5461SA1IPF	Broadcom	ETHERNET TRANSCEIVER		BALL	100	BGA	UNSPECIFIED	PLASTIC/EPOXY	YES	1		CMOS						GRID ARRAY							BOTTOM		X-PBGA-B100						NOT SPECIFIED	NOT SPECIFIED
DS33Z11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified				14 mm
DS33ZH11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100			10 mm	Not Qualified	e1		225	10 mm
PX1011B-EL1/N,551	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1012A-EL1/G,551	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1011A-EL1:557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	1	1.6 mm	9 mm	Not Qualified				9 mm
PX1011B-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1011B-EL1/N,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				9 mm
PX1011BI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified			260	9 mm
PX1012A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
TLK3114SAGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
CYP15G0101DXB-BBI	Cypress Semiconductor	INTERFACE CIRCUIT	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		1		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified	e0			11 mm
TLK2208GPV	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		8		1.8 V	1.8,1.8/2.5	GRID ARRAY	BGA289,17X17,40	Network Interfaces	1 mm	70 Cel	0 Cel		BOTTOM	1300 Mbps	S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
TLK3114SBGNT	Texas Instruments	SUPPORT CIRCUIT	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				2.5 V	1.5/2.5,2.5	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e0			27 mm
TLK3104SCGNT	Texas Instruments	ETHERNET TRANSCEIVER	OTHER	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				2.5 V		GRID ARRAY			1 mm	75 Cel	-40 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	19 mm
STULPI01ATBR	STMicroelectronics	SUPPORT CIRCUIT	INDUSTRIAL	BALL	36	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B36	3	1.16 mm	3.6 mm	Not Qualified	e1	30	260	3.6 mm
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
DLKPC192SGNT	Texas Instruments	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.8 V	1.8,2.5,3.3	GRID ARRAY	BGA289,17X17,40	Other Telecom ICs	1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B289		2 mm	19 mm	Not Qualified				19 mm
XA1243FPBGABL	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B161		1.17 mm	10.4 mm					10.4 mm
VSC8486YJB-11	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		GRID ARRAY, LOW PROFILE	BGA144,12X12,40		1 mm	85 Cel	-40 Cel		BOTTOM	.00001 Mbps	S-PBGA-B144		1.4 mm	13 mm					13 mm
VSC8504XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm					17 mm
VSC8552XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm					17 mm
VSC8562XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	1130 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			NOT SPECIFIED	NOT SPECIFIED	17 mm
VSC8572XKS-05	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2	800 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm					17 mm
VSC8575XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm					17 mm
VSC8584XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm		e1			17 mm
VSC8662XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm		e1			17 mm
BCM5387KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			812 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA256,16X16,40		1 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B256	3	1.7 mm	17 mm					17 mm
BCM53134PIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-45 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm					11 mm
BCM53242MIPBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		24	1450 mA	1.2 V		GRID ARRAY	BGA400,20X20,50		1.27 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-PBGA-B400		2.33 mm	27 mm					27 mm
BCM53242MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		24	1450 mA	1.2 V		GRID ARRAY	BGA400,20X20,50		1.27 mm	70 Cel	0 Cel		QUAD	1000 Mbps	S-PBGA-B400	3	2.33 mm	27 mm					27 mm
BCM53125MIMMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	186		SQUARE	PLASTIC/EPOXY	YES	1				1					BGA186(UNSPEC)						BOTTOM		S-PBGA-B186	3
TUSB2E22YCGT	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	2					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		.35 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.5 mm	2 mm			30	260	2 mm
BCM54140B0KFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		4				GRID ARRAY				70 Cel	0 Cel		BOTTOM		R-PBGA-B256						NOT SPECIFIED	NOT SPECIFIED
BCM54140B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		4				GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B256					e1		255
ADIN2299BBCZ	Analog Devices	ETHERNET TRANSCEIVER		BALL	194	BGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY	BGA194,17X17,87		2.2 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B194		3.56 mm	38 mm			NOT SPECIFIED	NOT SPECIFIED	38 mm
TLK10031CTR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	700 mA	1 V		GRID ARRAY	BGA144,12X12,40		1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10312.5 Mbps	S-PBGA-B144	4	3.25 mm	13 mm	Not Qualified	e1	30	260	13 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.