| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.03 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.04 Mbps |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
|||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
|||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
||||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
8.65 mm |
|||||||||||||||
|
|
Infineon Technologies |
LAN SWITCHING CIRCUIT |
GULL WING |
36 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
.65 mm |
DUAL |
R-PDSO-G36 |
3 |
2.55 mm |
7.6 mm |
Not Qualified |
260 |
12.8 mm |
|||||||||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
16 V |
5/27 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.1 Mbps |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
30 |
235 |
8.65 mm |
||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
16 V |
5/27 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
.1 Mbps |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
30 |
235 |
8.65 mm |
||||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.63SQ,32 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
10 mm |
||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.55SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
16 V |
5/27 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Tin (Sn) |
DUAL |
.1 Mbps |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
|||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.09 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
|
|
Holt Integrated Circuits |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
18 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G18 |
3 |
2.35 mm |
7.5 mm |
Not Qualified |
e3 |
260 |
11.55 mm |
||||||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
20 |
240 |
4.9 mm |
||||||||
|
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
10 mm |
||||||
|
|
Atmel |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
5 V |
5,7/32 |
SMALL OUTLINE |
SOP16,.25 |
Network Interfaces |
1.27 mm |
105 Cel |
-40 Cel |
MATTE TIN |
DUAL |
.25 Mbps |
R-PDSO-G16 |
1 |
1.75 mm |
3.8 mm |
Not Qualified |
e3 |
260 |
9.9 mm |
|||||||||
|
|
Texas Instruments |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
BICMOS |
1 |
.017 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4.9 mm |
|||||
|
|
Atmel |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BCDMOS |
1 |
.06 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
3.8 mm |
Not Qualified |
e3 |
260 |
4.925 mm |
||||||||
|
Freescale Semiconductor |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.018 mA |
13.5 V |
5.5/18 |
SMALL OUTLINE |
SOP28,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
.125 Mbps |
R-PDSO-G28 |
1 |
2.65 mm |
7.5 mm |
Not Qualified |
e0 |
30 |
240 |
17.925 mm |
||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
Not Qualified |
8.65 mm |
||||||||||||||||||||||
|
Holt Integrated Circuits |
MIL-STD-1553 DATA BUS TRANSCEIVER |
INDUSTRIAL |
GULL WING |
32 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
500 mA |
3.3 V |
FLATPACK, THIN PROFILE |
TQFP32,.35SQ,32 |
.8 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQFP-G32 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e0 |
30 |
240 |
7 mm |
||||||||||
|
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
6 mA |
3.3 V |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
4.9 mm |
|||||||
|
|
STMicroelectronics |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
100 Mbps |
S-PQFP-G64 |
3 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
|||||||
|
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
10 mm |
||||||
|
|
Freescale Semiconductor |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
13.5 V |
5.5/18 |
SMALL OUTLINE |
SOP28,.4 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G28 |
3 |
2.65 mm |
7.5 mm |
Not Qualified |
e3 |
40 |
260 |
17.925 mm |
||||||||
|
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
R-PDSO-G8 |
2 |
1.75 mm |
4.9 mm |
e3 |
30 |
260 |
6 mm |
|||||||||
|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMARTMOS |
AEC-Q100 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||
|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMARTMOS |
AEC-Q100 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||
|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMARTMOS |
AEC-Q100 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||
|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMARTMOS |
AEC-Q100 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||
|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMARTMOS |
AEC-Q100 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||
|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMARTMOS |
AEC-Q100 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||
|
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
SMARTMOS |
AEC-Q100 |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
||||||||||||||
|
|
Onsemi |
CAN FD, LIN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
36 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
AEC-Q100 |
2 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP36,.4,20 |
.5 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 Mbps |
R-PDSO-G36 |
3 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
|||||||||
|
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||
|
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e4 |
30 |
260 |
10.3 mm |
||||||||||||||
|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
2.794 mm |
7.493 mm |
e3 |
15.875 mm |
||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
85 Cel |
-45 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
TMII MODE SUPPORTS 200 MBPS DATA RATE |
28 mm |
||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
TMII MODE SUPPORTS 200 MBPS DATA RATE |
28 mm |
||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
28 mm |
||||||||||||||
|
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
256 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
7 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP256,1.2SQ,16 |
.4 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G256 |
3 |
1.6 mm |
28 mm |
ALSO REQUIRE 3.3V SUPPLY |
28 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.