NXP Semiconductors Network Interfaces 304

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PX1012A-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	COMMERCIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
PX1012AI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B81		1.6 mm	9 mm	Not Qualified	e1			9 mm
TJA1040T/N1,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TJA1040T/N1,518	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TJA1041AT,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.08 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
TJA1041AT,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.08 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
TJA1050T/N1,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	.075 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TJA1054AT/S900,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	.125 Mbps	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
TJA1055T,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	.021 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
TJA1080TS,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	.062 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Network Interfaces	.65 mm			NICKEL PALLADIUM GOLD	DUAL	10 Mbps	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e4			7.2 mm
UJA1065TW/5V0,512	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm	Not Qualified	e3		260	11 mm
TJA1041T/VM,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
MC33FS4500LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100											TIN				3				e3	40	260
MC33FS6502CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm			40	260	7 mm
MC33FS6512NAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100											TIN				3				e3	40	260
MC33FS6520CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER										AEC-Q100											TIN				3				e3	40	260
MC33FS6523CAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.32SQ,20		.5 mm	125 Cel	-40 Cel		QUAD		S-PQCC-N48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4500NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4501CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4501NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4502CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4502NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4503CAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
MC35FS4503NAE	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	48	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1	SMARTMOS	AEC-Q100	1				FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQFP-G48	3	1.6 mm	7 mm			40	260	7 mm
TJA1028T/3V3/20:11	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1028T/5V0/20/1U	NXP Semiconductors	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm		e4	30	260	4.9 mm
TJA1028TK/3V3/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
TJA1028TK/5V0/10:1	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
TJA1028TK/5V0/20/X	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1	4.5 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL		S-PDSO-N8	1	1 mm	3 mm				260	3 mm
UJA1075ATW/3V3/1J	NXP Semiconductors	ETHERNET TRANSCEIVER																					NICKEL PALLADIUM GOLD SILVER				1				e4	30	260
UJA1075ATW/3V3/WDJ	NXP Semiconductors	ETHERNET TRANSCEIVER																					NICKEL PALLADIUM GOLD SILVER				1				e4	30	260
UJA1075ATW/5V0/1J	NXP Semiconductors	ETHERNET TRANSCEIVER																					NICKEL PALLADIUM GOLD SILVER				1				e4	30	260
TJA1043T/1U	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm				260	8.65 mm
TJA1020T/VM,112	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1020T/VM,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			12 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1040T/H/V,518	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1	75 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
TJA1041T/VM,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm					8.65 mm
TJA1042T/1U	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1042T/3/1U	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1049T,112	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	65 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		30	260	4.9 mm
TJA1051T/1U	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1051T/3/1U	NXP Semiconductors	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			1	70 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm				260	4.9 mm
TJA1054AT/M,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100			5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
TJA1054T/N1M,518	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm					8.65 mm
UJA1061TW/3V3/C/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm				260	11 mm
UJA1061TW/5V0/C/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm				260	11 mm
UJA1065TW/5V0/C/T	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm			30	260	11 mm
UJA1066TW/3V3/T	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	32	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		AEC-Q100					SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	DUAL		R-PDSO-G32	3	1.1 mm	6.1 mm		e4	30	260	11 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.