14 Other Function Telecom Interface ICs 17

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
XR2211ACD-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.009 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G14	2	1.75 mm	3.9 mm	Not Qualified	e3			8.65 mm
XR2211ACDTR-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			12 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G14	2	1.75 mm	3.9 mm	Not Qualified	e3			8.65 mm
XR2211ACP-F	Exar	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.009 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDIP-T14		5.33 mm	7.62 mm	Not Qualified	e3			19.305 mm
AFEM-S105-BLKG	Broadcom	TELECOM CIRCUIT		NO LEAD	14	HQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG							QUAD	S-XQCC-N14	3		3.2 mm				260	3.2 mm
AFEM-S105-TR1G	Broadcom	TELECOM CIRCUIT		NO LEAD	14	HQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG							QUAD	S-XQCC-N14	3		3.2 mm				260	3.2 mm
AFEM-S106-BLKG	Broadcom	TELECOM CIRCUIT	OTHER	BUTT	14	HBCC	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-30 Cel		BOTTOM	S-XBCC-B14	3		3.2 mm				260	3.2 mm
AFEM-S106-TR1G	Broadcom	TELECOM CIRCUIT	OTHER	BUTT	14	HBCC	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-30 Cel		BOTTOM	S-XBCC-B14	3		3.2 mm				260	3.2 mm
RF430CL330HTB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G14
HTRC11001T/02EE,11	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.01 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1		4 mm	Not Qualified	e4	30	260	8.75 mm
SA5211D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
SA5211D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
SA5211D,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.031 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		40	260	8.65 mm
ADN2820ACHIPS	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR			3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-15 Cel		UPPER	R-XUUC-N14				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
BGS16MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD	S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
RF430CL330HTPWRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100		3.3 V		SMALL OUTLINE				105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-XDSO-G14	2				e4	30	260
BGS18GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD	S-XQMA-B14	1	.65 mm	2 mm					2 mm
BGS16GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-30 Cel		BOTTOM	S-PBCC-N14	1	.65 mm	2 mm					2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.