144 Other Function Telecom Interface ICs 20

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TLK10022CTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V	GRID ARRAY, HEAT SINK/SLUG		1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B144	4	3.25 mm	13.05 mm		e1	30	260	13.05 mm
AD9364BBCZREEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm		e1	30	260	10 mm
AD9364BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm		e1	30	260	10 mm
FIDO5100CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5200CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5110BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5110CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5210BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5210CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9671KBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.4 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm			30	260	10 mm
AD9670BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.4 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm			30	260	10 mm
AD9363ABCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			30	260	10 mm
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			30	260	10 mm
AD9172BBPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.71 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5100BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5200BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
EC25EFA-512-STD	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	144	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	150 Mbps	R-XXMA-N144		2.4 mm	29 mm					32 mm
EC25EUXGA-128-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	144	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	MICROELECTRONIC ASSEMBLY			75 Cel	-35 Cel		UNSPECIFIED	150 Mbps	R-XXMA-N144		2.4 mm	29 mm					32 mm
EC21EUGA-512-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	144	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	10 Mbps	R-XXMA-N144		2.4 mm	29 mm	SEATED HEIGHT NOM				32 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.