16 Other Function Telecom Interface ICs 78

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CRX14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	20 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3			Not Qualified	e4	30	260
LA72910V-MPB-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
LA72910V-TLM-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES					5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
LA72914V-MPB-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			BIPOLAR	.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	-20 Cel	TIN BISMUTH	DUAL		R-PDSO-G16	3			Not Qualified	e6	30	260
TPS657051YZHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B16	1	.625 mm	2.3 mm	Not Qualified	e1	30	260	2.3 mm
TPS657052YZHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	UNSPECIFIED	YES	1				3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-XBGA-B16	1	.625 mm	2.3 mm	Not Qualified	e1	NOT SPECIFIED	260	2.3 mm
ADP5585ACBZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1	30	260	1.59 mm
NCV7425DW0G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm	7.5 mm		e3			10.3 mm
NCV7425DW0R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm		e3		260	10.3 mm
NCV7425DW5G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16		2.65 mm	7.5 mm		e3			10.3 mm
NCV7425DW5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	2	2.65 mm	7.5 mm		e3	30	260	10.3 mm
TMS3705BDRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.91 mm	Not Qualified	e4	30	260	9.9 mm
TPIC82010FFER	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	16	DIE	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	YES	1				3 V		UNCASED CHIP				125 Cel	-40 Cel		UPPER		X-CUUC-N16
ADP5586ACBZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B16	1	.545 mm	1.59 mm		e1			1.59 mm
TDA5102XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDA5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDA5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5111XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.0195 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5110XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
TDK5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				5 mm
SST12LF02-QXCE	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N16		.5 mm	3 mm		e3			3 mm
BGS15AN16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	QUAD		S-PQCC-N16	1	.77 mm	2.3 mm		e3			2.3 mm
CC2595RGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	2	1 mm	3 mm		e4	30	260	3 mm
BA4116FV-E2	ROHM	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN/TIN COPPER	DUAL		R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified	e3/e2	10	260	5 mm
MAX3750CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3751CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.078 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.89 mm
AD9832BRU-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0		240	5 mm
MAX3265CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
AD9832BRU	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0		240	5 mm
MAX3265EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0	20	240	5 mm
MAX3750CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
TMS3705A1DRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm	Not Qualified	e4	30	260	9.9 mm
ZABG4002JA16TC	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	.65 mm	3 mm	Not Qualified	e4	30	260	3 mm
U2270B-MFPY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, LOW PROFILE			1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.4 mm	3.8 mm	Not Qualified	e3		260	9.9 mm
TLK6201EARGTRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.067 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	6250 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified	e4	NOT SPECIFIED	260	3 mm
TLK6201EARGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.067 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	6250 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified	e4	NOT SPECIFIED	260	3 mm
TLK4201EARGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.038 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	4250 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
HCPL-800J-500E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.056 mA	5 V	5	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-G16	1	3.632 mm	7.493 mm	Not Qualified	e3		260	10.312 mm
STMPE610QTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
UAA3201T/V1,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES						3.5/6	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16				Not Qualified
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
ONET8501PBRGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified	e4	NOT SPECIFIED	260	3 mm
TDA5101	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
AD9832BRU-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0		240	5 mm
RI-TMS3705ADR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	3	1.75 mm	3.9 mm	Not Qualified	e4			9.9 mm
ADA2200ARUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm		e3	30	260	5 mm
ADA2200ARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G16	1	1.2 mm	4.4 mm		e3	30	260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.