18 Other Function Telecom Interface ICs 11

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

MCP2140A-I/P

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

TS 16949

3 V

IN-LINE

DIP18,.3

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T18

5.334 mm

7.62 mm

Not Qualified

e3

22.86 mm

MCP2140A-I/SO

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

3 V

SMALL OUTLINE

SOP18,.4

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G18

2

2.65 mm

7.5 mm

Not Qualified

e3

40

260

11.55 mm

MCP2150-I/SO

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

3.3 V

SMALL OUTLINE

SOP18,.4

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G18

2

2.64 mm

7.49 mm

Not Qualified

e3

40

260

17.87 mm

MCP2140-I/SO

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

3 V

SMALL OUTLINE

SOP18,.4

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G18

2

2.64 mm

7.49 mm

Not Qualified

e3

11.53 mm

ONET9901TAY

Texas Instruments

TELECOM CIRCUIT

OTHER

NO LEAD

18

DIE

RECTANGULAR

UNSPECIFIED

YES

1

.041 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

0 Cel

UPPER

R-XUUC-N18

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

MAX-8Q-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

18

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N18

4

2.7 mm

9.7 mm

245

10.1 mm

MAX-8Q

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

18

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N18

NOT SPECIFIED

NOT SPECIFIED

PI3EQX1001XUAEX

Diodes Incorporated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

18

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N18

.4 mm

2 mm

NOT SPECIFIED

NOT SPECIFIED

2 mm

SIM68M

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

18

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N18

ZM3102AU-CME1R

Silicon Labs

TELECOM CIRCUIT

NO LEAD

18

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

UNSPECIFIED

.04 Mbps

R-XXMA-N18

ZM3102AE-CME1

Silicon Labs

TELECOM CIRCUIT

NO LEAD

18

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

UNSPECIFIED

.04 Mbps

R-XXMA-N18

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.