24 Other Function Telecom Interface ICs 71

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BH1417FV-E2	ROHM		INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					28 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.3	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24				Not Qualified
BGX7100HN/1,118	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES						5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
BGX7100HN/1,115	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES						5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
LA72912V-MPB-H	Onsemi		OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES			BIPOLAR		.032 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel	-30 Cel	TIN BISMUTH	DUAL		R-PDSO-G24	3			Not Qualified	e6	30	260
ADP5589ACPZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm	3.5 mm		e3	30	260	3.5 mm
ADP5589ACPZ-02-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	.8 mm	3.5 mm		e3	30	260	3.5 mm
DS100BR111ASQ/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	10300 Mbps	S-PQCC-N24	3	.8 mm	4 mm		e3	30	260	4 mm
DS100BR111ASQE/NOPB	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	2				2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	10300 Mbps	S-PQCC-N24	3	.8 mm	4 mm		e3	30	260	4 mm
ENW89829A2KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	9 mm			50	250	9.5 mm
HPA02286ARLL	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	1 mm	3 mm		e4	30	260	3 mm
ADN2915ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		.3774 mA	3.3 V	1.2,1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3			4 mm
ADN2917ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm		e3		260	4 mm
ADN2917ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm		e3			4 mm
ADN2913ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm		e3		260	4 mm
ADN2913ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm		e3		260	4 mm
NB7VQ1006MMNG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				.2 mA	1.8 V	1.8/2.5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
SN65LVPE501RGET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2	2	CMOS		.12 mA	3.3 V	3.3	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	5 Mbps	S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
SN65LVPE502RGET	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	2	2	CMOS		.12 mA	3.3 V	3.3	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	5 Mbps	S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified	e4		260	7.8 mm
UAA3220TS/V1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		2 mm	5.3 mm					8.2 mm
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified		40	260	7.8 mm
SN761634RTWR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	.8 mm	4 mm	Not Qualified	e4	30	260	4 mm
AD1803JRU	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified	e0			7.8 mm
HPA02232ARGER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N24	2	1 mm	4 mm		e4	NOT SPECIFIED	260	4 mm
ADM1041ARQ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e0		240	8.6614 mm
ADL5390ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADL5390ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
ADF7012BRU-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e0			7.8 mm
ADM1041ARQZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e3	30	260	8.6614 mm
ADF7012BRUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	7.8 mm
ADF7012BRUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	7.8 mm
ADM1041AARQZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e3		260	8.6614 mm
ADM1041AARQZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e3	30	260	8.6614 mm
NEO-M8U-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	DMA	RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100; TS 16949		3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N24	4	2.6 mm	12.2 mm			NOT SPECIFIED	NOT SPECIFIED	16 mm
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		e4			19.5 mm
STA020DJTR	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	3	2.65 mm	7.5 mm		e4		260	15.4 mm
LNBH26LSPQR	STMicroelectronics	TELECOM CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1					12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N24	1	1 mm	4 mm					4 mm
TFF1007HN/N1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF1007HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF11086HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF11086HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF11092HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	1	1 mm	4 mm		e4	30	260	4 mm
TFF11092HN/N1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF11101HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF11101HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF11115HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
TFF11139HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
TFF11139HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.