30 Other Function Telecom Interface ICs 14

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

RI-STU-MRD1-30

Texas Instruments

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

30

RECTANGULAR

UNSPECIFIED

NO

1

5 V

MICROELECTRONIC ASSEMBLY

50 Cel

-20 Cel

DUAL

R-XDMA-T30

LM3290TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LM3290TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

DS2291/87-22291-000

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

NO

1

5 V

MICROELECTRONIC ASSEMBLY

70 Cel

0 Cel

TIN LEAD

SINGLE

R-XSMA-N30

Not Qualified

e0

BM77SPPS3MC2-0007AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

MODULE,30LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

.1125 Mbps

R-XXMA-N30

1.86 mm

12 mm

NOT SPECIFIED

NOT SPECIFIED

15 mm

BM78SPP05MC2-0002AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,30LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

GOLD OVER NICKEL

UNSPECIFIED

R-XXMA-N30

1.86 mm

12 mm

e4

40

255

15 mm

SPWF04SA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N30

2.3 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

SPWF04SC

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N30

2.3 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

PI3PCIE3242ZLEX

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

R-XQCC-N30

.8 mm

2.5 mm

30

260

4.5 mm

RN4870U-V/RM118

Microchip Technology

TELECOM CIRCUIT

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3 V

MICROELECTRONIC ASSEMBLY

70 Cel

-20 Cel

UNSPECIFIED

.01 Mbps

R-XXMA-N30

1.6 mm

12 mm

15 mm

LC72720YVS-MPB-E

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

30

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN BISMUTH

DUAL

R-PDSO-G30

4

1.5 mm

5.6 mm

e6

30

260

9.75 mm

LC72720YVS-TLM-E

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

30

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN BISMUTH

DUAL

R-PDSO-G30

4

1.5 mm

5.6 mm

e6

30

260

9.75 mm

BM70BLE01FC2-0B04AA

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3 V

MICROELECTRONIC ASSEMBLY

MODULE,30LEAD(UNSPEC)

1.1 mm

85 Cel

-40 Cel

UNSPECIFIED

.0086 Mbps

R-XXMA-N30

.66 mm

12 mm

15 mm

BM70BLE01FC2-0B05BA

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

3 V

MICROELECTRONIC ASSEMBLY

MODULE,30LEAD(UNSPEC)

1.1 mm

85 Cel

-40 Cel

Nickel/Gold (Ni/Au)

UNSPECIFIED

.0086 Mbps

R-XXMA-N30

1.66 mm

12 mm

e4

15 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.