36 Other Function Telecom Interface ICs 30

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CC1110F32RSPG3

Texas Instruments

INDUSTRIAL

NO LEAD

36

QCCN

SQUARE

PLASTIC/EPOXY

YES

CMOS

3 V

3

CHIP CARRIER

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N36

3

Not Qualified

e4

30

260

PCC2510F32RSPR

Texas Instruments

INDUSTRIAL

NO LEAD

36

QCCN

SQUARE

PLASTIC/EPOXY

YES

CMOS

2.5/3.3

CHIP CARRIER

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N36

Not Qualified

MRF24WG0MAT-I/RM

Microchip Technology

INDUSTRIAL

36

PLASTIC/EPOXY

3.3 V

3.3

MICROELECTRONIC ASSEMBLY

MODULE,36LEAD,.8

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

SKY73087-11

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N36

3

1.15 mm

6 mm

Not Qualified

6 mm

ALM-11236-BLKG

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

.845 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N36

2

1.6 mm

7 mm

260

10 mm

ALM-11236-TR1G

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

.845 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N36

2

1.6 mm

7 mm

260

10 mm

ALM-11336-BLKG

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

.845 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N36

2

1.6 mm

7 mm

260

10 mm

ALM-11336-TR1G

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER

.845 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N36

2

1.6 mm

7 mm

260

10 mm

CC1180RSPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

e4

30

260

6 mm

CC1180RSPT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N36

3

.9 mm

6 mm

e4

30

260

6 mm

MRF24WG0MA-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

3.3

MICROELECTRONIC ASSEMBLY

MODULE,36LEAD,.8

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDMA-N36

2.7 mm

21 mm

Not Qualified

e3

31 mm

LMX5252LQX/NOPB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.055 mA

2.75 V

2.75

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N36

3

.8 mm

6 mm

Not Qualified

e3

30

260

6 mm

MAX5935CAX

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

GULL WING

36

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

SMALL OUTLINE, SHRINK PITCH

.8 mm

70 Cel

0 Cel

DUAL

R-PDSO-G36

2.65 mm

7.5 mm

NOT SPECIFIED

NOT SPECIFIED

15.375 mm

ADL5354ACPZ-R2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N36

1

1 mm

6 mm

Not Qualified

e3

6 mm

MAX2023ETX-T

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

VQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.345 mA

5 V

5

CHIP CARRIER, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N36

1

.8 mm

6 mm

Not Qualified

6 mm

MAX2023ETX

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

VQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.345 mA

5 V

5

CHIP CARRIER, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N36

1

.8 mm

6 mm

Not Qualified

e0

245

6 mm

MRF24WB0MA/RM

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

36

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

3.3

UNCASED CHIP

MODULE,36LEAD,.8

Other Telecom ICs

70 Cel

0 Cel

MATTE TIN

UPPER

R-XUUC-N36

Not Qualified

e3

MRF24WB0MB/RM

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

36

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

70 Cel

0 Cel

MATTE TIN

UPPER

R-XUUC-N36

Not Qualified

e3

BGX7221HN/1,518

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-PQCC-N36

3

1 mm

6 mm

260

6 mm

BGM113A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

2.09 mm

9.15 mm

15.73 mm

BLE113-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N36

2 mm

9.15 mm

15.73 mm

BLE121LR-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.9 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

1.8 mm

13 mm

14.7 mm

NL3HS644FCTAG

Onsemi

TELECOM CIRCUIT

BALL

36

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

BOTTOM

S-PBGA-B36

.54 mm

2.34 mm

NOT SPECIFIED

NOT SPECIFIED

2.34 mm

MRF24WG0MART-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N36

2.7 mm

21 mm

31 mm

MRF24WG0MA-I/RM10C

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N36

2.7 mm

21 mm

31 mm

MRF24WG0MB-I/RM10C

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N36

2.7 mm

21 mm

31 mm

MRF24WG0MBR-I/RM10C

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

NO

1

TS 16949

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N36

2.7 mm

21 mm

31 mm

MRF24WG0MAT-I/RM10C

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

36

RECTANGULAR

UNSPECIFIED

1

TS 16949

3.3 V

85 Cel

-40 Cel

2.7 mm

21 mm

31 mm

BGM113A256V21

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

2 mm

9.15 mm

15.73 mm

BLE113-A-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

3

2.09 mm

9.15 mm

Operates from 2V to 3.6V supply

40

260

15.725 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.