6 Other Function Telecom Interface ICs 27

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SL3S1204FTB0X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES						SMALL OUTLINE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6				Not Qualified
SKY16406-381LF	Skyworks Solutions	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel		DUAL	R-PDSO-N6		.8 mm	1.5 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
TCP-3012H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	1					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		DUAL	R-XDSO-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3027H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3082H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3033H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3068H-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm			NOT SPECIFIED	NOT SPECIFIED	1.6 mm
TCP-3027N-QT	Onsemi	TELECOM CIRCUIT	OTHER	NO LEAD	6	VQCCN	RECTANGULAR	UNSPECIFIED	YES	1					CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD	R-XQCC-N6		1 mm	1.2 mm					1.6 mm
BGA711N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGM1032N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM1043N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGS12AL74E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.55 mm	85 Cel	-30 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.5 mm	1.5 mm		e4			2.3 mm
BGS12AL76E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER			.48 mm	85 Cel	-30 Cel	GOLD	BOTTOM	R-XBCC-B6	1	.4 mm	1.4 mm		e4			1.26 mm
SKY13453-385LF	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	QCCN	SQUARE	UNSPECIFIED	YES	1			2.8 V		CHIP CARRIER				90 Cel	-40 Cel		QUAD	S-XQCC-N6	1	.5 mm	1 mm				260	1 mm
MAX2472EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
MAX2473EUT-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1.45 mm	1.625 mm		e0			2.9 mm
BGS12SL6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6		.32 mm	.7 mm			NOT SPECIFIED	NOT SPECIFIED	1.1 mm
MP45DT02TR-M	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	LGA	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		GRID ARRAY				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-XBGA-N6	3	1.35 mm	3.76 mm		e4		260	4.72 mm
ALM-GN001-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.9 mm	1.7 mm					2.3 mm
ALM-GN001-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.9 mm	1.7 mm					2.3 mm
BGU8004X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	.32 mm	.44 mm				260	.65 mm
BGU8004Z	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6	1	.32 mm	.44 mm				260	.65 mm
SL3S1003FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.5 mm	1 mm					1.45 mm
SL3S1213FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.265 mA	1.8 V	1.8	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
BGM1033N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
IP4047CX6/LF,135	Nexperia	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B6		.7 mm	.99 mm					1.44 mm
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM	R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.