80 Other Function Telecom Interface ICs 10

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2			.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm	12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
LM96551SQ/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel		QUAD		S-XQCC-N80		3	.8 mm	12 mm					30	260	12 mm
LM96551SQE/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-XQCC-N80		3	.8 mm	12 mm				e3	30	260	12 mm
LM96551SQX/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel		QUAD		S-XQCC-N80		3	.8 mm	12 mm					30	260	12 mm
LM96550SQX/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS	-10 V		10 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-XQCC-N80		3	.8 mm	12 mm				e3	30	260	12 mm
TLK2541PFPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80		3	1.2 mm	12 mm	Not Qualified			e4	30	260	12 mm
TLV320VD30PN	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	2.5/3.3,3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD	52 Mbps	S-PQFP-G80			1.6 mm	12 mm	Not Qualified						12 mm
TRF2443IPFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80		3	1.2 mm	12 mm	Not Qualified			e4	30	260	12 mm
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80		3	1 mm	5 mm	Not Qualified			e1	30	260	5 mm
AD9857ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE	QFP80,.64SQ	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	MATTE TIN	QUAD		S-PQFP-G80		3	1.6 mm	14 mm	Not Qualified			e3	40	260	14 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.