BCC Other Function Telecom Interface ICs 12

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGS12AL74E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.55 mm

85 Cel

-30 Cel

GOLD

BOTTOM

R-XBCC-B6

1

.5 mm

1.5 mm

e4

2.3 mm

BGS12AL76E6327XTMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.48 mm

85 Cel

-30 Cel

GOLD

BOTTOM

R-XBCC-B6

1

.4 mm

1.4 mm

e4

1.26 mm

BGS12SL6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

.32 mm

.7 mm

NOT SPECIFIED

NOT SPECIFIED

1.1 mm

AMMP-6532-BLKG

Broadcom

TELECOM CIRCUIT

BUTT

8

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

NICKEL GOLD

BOTTOM

S-XBCC-B8

3

2.25 mm

5.215 mm

Not Qualified

e4

20

260

5.215 mm

AMMP-6532-TR1G

Broadcom

TELECOM CIRCUIT

BUTT

8

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

NICKEL GOLD

BOTTOM

S-XBCC-B8

3

2.25 mm

5.215 mm

Not Qualified

e4

20

260

5.215 mm

XCC2564MODNCMOET

Texas Instruments

TELECOM CIRCUIT

OTHER

BUTT

33

BCC

SQUARE

UNSPECIFIED

YES

1

3.6 V

CHIP CARRIER

70 Cel

-20 Cel

BOTTOM

S-XBCC-B33

1.4 mm

7 mm

7 mm

BGS13SL9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

9

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

S-XBCC-B9

.32 mm

1.15 mm

1.15 mm

SL3S1202FTB1,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

.55 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-PBCC-B3

1

.5 mm

1 mm

Not Qualified

e3

30

260

1.45 mm

BGS13PN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

e3

1.5 mm

BGS110MN20E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

20

BCC

SQUARE

UNSPECIFIED

YES

1

3.5 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

S-XBCC-B20

1

.77 mm

2.3 mm

2.3 mm

BGA5M1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

1.1 mm

BGAU1A10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.65 mm

1.1 mm

1.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.