BGA Other Function Telecom Interface ICs 27

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CC2564NSYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564NYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564YFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564YFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

TLK3138ZDU

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

2

CMOS

2

1.2 V

1.2,1.5,2.5

GRID ARRAY

BGA484,22X22,40

Network Interfaces

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3125 Mbps

S-PBGA-B484

4

2.42 mm

23 mm

Not Qualified

e1

30

260

23 mm

DS31256B

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.54 mm

27 mm

Not Qualified

e0

27 mm

TLK3138GDU

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

2

CMOS

2

1.2 V

1.2,1.5,2.5

GRID ARRAY

BGA484,22X22,40

Network Interfaces

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

3125 Mbps

S-PBGA-B484

4

Not Qualified

e0

20

220

TLK3134ZEL

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

1.2,1.5,2.5

GRID ARRAY

BGA289,17X17,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3750 Mbps

S-PBGA-B289

4

2.48 mm

19 mm

Not Qualified

e1

30

260

19 mm

STLC60845

STMicroelectronics

TELECOM CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B292

Not Qualified

GC4016-PBZ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

160

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B160

3

1.75 mm

15 mm

Not Qualified

e1

30

260

15 mm

AD6652BBCZ

Analog Devices

TELECOM CIRCUIT

OTHER

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

1 mm

70 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

17 mm

Not Qualified

e1

260

17 mm

VSC8484YJP

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

1 mm

105 Cel

-40 Cel

BOTTOM

S-PBGA-B324

2.74 mm

18.6 mm

18.6 mm

LMS7002M

Lime Microsystems

TELECOM CIRCUIT

INDUSTRIAL

BALL

261

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B261

11.5 mm

11.5 mm

PM5440B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1894

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1894

PM5980B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

PM5981B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

PM5990B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

PM5991B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

WP3160W6NFEI-320B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

WP3161F5NFEI-320B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

WP3161W6NFEI-320B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

WP3161D4NFEI-400B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

AD9988BBPZRL-4D4AC

Analog Devices

TELECOM CIRCUIT

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, HEAT SINK/SLUG

.8 mm

120 Cel

-40 Cel

BOTTOM

S-PBGA-B324

1.72 mm

15 mm

15 mm

ADRV9004BBCZ-RL

Analog Devices

TELECOM CIRCUIT

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2

1 V

GRID ARRAY

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.25 mm

12 mm

30

260

12 mm

ADRV9004BBCZ

Analog Devices

TELECOM CIRCUIT

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2

1 V

GRID ARRAY

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.25 mm

12 mm

30

260

12 mm

AFE7903IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

e1

260

17 mm

AFE7903IALK

Texas Instruments

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

e0

220

17 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.