HVSON Other Function Telecom Interface ICs 18

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SKY16406-381LF	Skyworks Solutions	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-55 Cel		DUAL	R-PDSO-N6		.8 mm	1.5 mm			NOT SPECIFIED	NOT SPECIFIED	2 mm
SX8651IWLTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.45 mm	85 Cel	-40 Cel	TIN	DUAL	S-PDSO-N12	2	.8 mm	3 mm		e3		260	3 mm
BGA711N7E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	TIN	DUAL	R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
BGM1034N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	7	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N7		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM1032N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM1043N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm
TRF37A73IDSGT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	1	.8 mm	2 mm		e4	30	260	2 mm
SST12LP17E-QU8E	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	3	.6 mm	2 mm		e3			2 mm
ALM-GN001-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.9 mm	1.7 mm					2.3 mm
ALM-GN001-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.9 mm	1.7 mm					2.3 mm
MAX3658AETA-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
OPA2381AIDRBR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-N8		1 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
OPA381AIDRBR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
AD8315ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.0129 mA	2.7 V	3/5	SMALL OUTLINE	SOLCC8,.08,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	MATTE TIN	DUAL	R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e3	30	260	3 mm
OPA2381AIDRBRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-N8		1 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
OPA381AIDRBRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			.0011 mA	5 V	3/5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N8	2	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
NCV7428MW3R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	1 mm	3 mm		e3	30	260	3 mm
BGM1033N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL	R-PDSO-N6		.77 mm	1.7 mm			NOT SPECIFIED	NOT SPECIFIED	2.3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.