LFQFP Other Function Telecom Interface ICs 20

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

AFE4300PN

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BINARY/TWOS COMP

2

.00097 mA

3.3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Codecs

.5 mm

70 Cel

16

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

VOLTAGE

3

1.6 mm

12 mm

Not Qualified

DIFFERENTIAL

3.4 V

e4

30

260

12 mm

TLV320VD30PN

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

2.5/3.3,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.55SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

52 Mbps

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

12 mm

SA58646BD,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

1

1.6 mm

10 mm

Not Qualified

e3

10 mm

TDA7541

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

AD9874BST

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.0265 mA

3 V

3/3.3,3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

e0

7 mm

AD9874ABST

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

3/3.3,3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

TLV320AIC22CPTR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

2

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Codecs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

4

1.6 mm

16-BIT

7 mm

Not Qualified

A/MU-LAW

e4

30

260

7 mm

YES

AD9874ABSTRL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

3/3.3,3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

AD9860BSTZ

Analog Devices

TELECOM CIRCUIT

OTHER

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

Other Telecom ICs

.5 mm

70 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

1.6 mm

14 mm

Not Qualified

e3

30

260

20 mm

AD9860BSTZRL

Analog Devices

TELECOM CIRCUIT

OTHER

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

Other Telecom ICs

.5 mm

70 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

1.6 mm

14 mm

Not Qualified

e3

260

20 mm

AD9862BSTZ

Analog Devices

TELECOM CIRCUIT

OTHER

GULL WING

128

LFQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP128,.63X.87,20

Other Telecom ICs

.5 mm

70 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

1.6 mm

14 mm

Not Qualified

e3

30

260

20 mm

AD9878BSTZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP100,.63SQ,20

Modems

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G100

3

1.6 mm

14 mm

Not Qualified

e3

260

14 mm

AD9856ASTZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

Not Qualified

e3

30

260

7 mm

TLC320AD545PTG4

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TWOS COMPLEMENT

1

3.3 V

TWOS COMPLEMENT

3.3/5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Codecs

.5 mm

70 Cel

16

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

DIFFERENTIAL

3 V

e4

30

260

7 mm

TB6865AFG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

100

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G100

1.7 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

ADF7030-1BSTZN-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

30

260

7 mm

ADF7030-1BSTZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

30

260

7 mm

MWCT1013VLHSTR

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

10 mm

MWCT1013VLHST

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

10 mm

MWCT1001AVLHR

NXP Semiconductors

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

e3

40

260

10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.