LGA Other Function Telecom Interface ICs 16

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
WL1801MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
WL1805MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
WL1805MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
WL1831MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
XWL1801MODGAMOCT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY			.7 mm	70 Cel	-20 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm					13.4 mm
XWL1805MODGAMOCT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY			.7 mm	70 Cel	-20 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm					13.4 mm
XWL1831MODGAMOCT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY			.7 mm	70 Cel	-20 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm					13.4 mm
XWL1835MODGAMOCT	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.7 V		GRID ARRAY			.7 mm	70 Cel	-20 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm					13.4 mm
MP45DT02TR-M	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	LGA	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V		GRID ARRAY				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-XBGA-N6	3	1.35 mm	3.76 mm		e4		260	4.72 mm
ZED-F9P-01B	U-blox Ag	GNSS Module	INDUSTRIAL	BUTT	54	LGA	RECTANGULAR		YES	1	TS 16949	3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-B54
WL1807MODGIMOCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
XWL1837MODGIMOC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.7 V		GRID ARRAY			.7 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-N100		2 mm	13.3 mm					13.4 mm
ZED-F9P-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	LGA	RECTANGULAR	UNSPECIFIED	YES	1	AEC-Q100	3 V		GRID ARRAY			1.1 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N54		2.6 mm	17 mm					22 mm
ZED-F9T-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	54	LGA	RECTANGULAR	UNSPECIFIED	YES	1	AEC-Q100	3 V		GRID ARRAY			1.1 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-B54	4	2.6 mm	17 mm					22 mm
WFM200SS22XNA2	Silicon Labs	TELECOM CIRCUIT		NO LEAD	52	LGA	SQUARE	UNSPECIFIED	YES	1		1.8 V		GRID ARRAY	LGA52(UNSPEC)		.5 mm	105 Cel	-40 Cel		BOTTOM	72.2 Mbps	S-XLGA-N52	3	1.4 mm	6.5 mm			40	260	6.5 mm
BG95M5LA-64-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	102	LGA	RECTANGULAR	UNSPECIFIED	YES	1		3.8 V		GRID ARRAY	LGA102(UNSPEC)			75 Cel	-35 Cel		BOTTOM	1.119 Mbps	R-XBGA-N102		2.2 mm	19.9 mm					23.6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.