TSSOP Other Function Telecom Interface ICs 74

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BH1417FV-E2	ROHM		INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				28 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.3	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24				Not Qualified
SI4012-C1001GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G10		1.1 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4010-C2-GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10	2	1.1 mm	3 mm	Not Qualified		e4	40	260	3 mm
TDA5210XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel	TIN	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
TDA5102XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDA5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDA5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDA5103AHTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR	.0095 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5111XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.0195 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDA5250XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G38	3	1.2 mm	4.4 mm	Not Qualified					9.7 mm
TDK5110XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDK5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDK5110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR	.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDA5212XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified					9.7 mm
TDA7100HTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	-20 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5111FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5100FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDK5101FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDA5220XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel		DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified					9.7 mm
TDA5150HTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN	DUAL	S-PDSO-G10	1	1.05 mm	3 mm	Not Qualified		e3			3 mm
TDA7116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3			3 mm
TDA5200XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
TDA5201XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
TDK5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified					5 mm
TDA5252XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G38	3	1.2 mm	4.4 mm						9.7 mm
TDA5251XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G38		1.2 mm	4.4 mm				NOT SPECIFIED	NOT SPECIFIED	9.7 mm
TDA5255XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G38	3	1.2 mm	4.4 mm						9.7 mm
BA4116FV-E2	ROHM	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	TIN/TIN COPPER	DUAL	R-PDSO-G16		1.2 mm	4.4 mm	Not Qualified		e3/e2	10	260	5 mm
MAX3120CUA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
MAX3120EUA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
AD9832BRU-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0		240	5 mm
AD9832BRU	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0		240	5 mm
TRF8011PWP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	350 mA	4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6.5 mm
AD8314ARM-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0		240	3 mm
AD8314ARM	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0		240	3 mm
PCM3060PW	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS		3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	30	260	9.7 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified		e4		260	7.8 mm
PCM3060PWRG4	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS		3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G28	2	1.2 mm	4.4 mm	Not Qualified		e4	NOT SPECIFIED	260	9.7 mm
XRT85L61IG-F	Exar	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified			40	260	7.8 mm
SA647DH,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4			6.5 mm
SA647DH,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified					6.5 mm
TDA5101	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL	R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified				260	5 mm
TSC2200IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	SINGLE-ENDED	e4	30	260	9.7 mm
AD1803JRU	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified		e0			7.8 mm
AD9832BRU-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified		e0		240	5 mm
TDA5204	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	.0064 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G28	3	1.2 mm	4.4 mm	Not Qualified				235	9.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.