VFBGA Other Function Telecom Interface ICs 50

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TPS657051YZHT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

30

260

2.3 mm

TPS657052YZHT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

BQ51011YFFR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

BQ51013YFFT

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

ADP5585ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.545 mm

1.59 mm

e1

30

260

1.59 mm

ADP5589ACBZ-00-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.56 mm

1.99 mm

e1

30

260

1.99 mm

ADP5589ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.56 mm

1.99 mm

e1

30

260

1.99 mm

BQ51013AYFPR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BQ51013AYFPT

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

SN65DSI83ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

SN65DSI85ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

BQ51013BYFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

LMV1099TLX/NOPB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B25

1

.675 mm

2.64 mm

e1

30

260

2.764 mm

ADP5586ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.545 mm

1.59 mm

e1

1.59 mm

SX8651ICSTRT

Semtech

TELECOM CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBGA-B12

1

.625 mm

1.5 mm

e4

260

2 mm

SN65DSI86ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

5400 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

TCC-106A-RT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B20

.65 mm

2.23 mm

2.58 mm

LM3290TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LM3290TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LM3291TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

LM3291TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

BQ51010BYFPT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BQ51021YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

STPAC01F2

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

8

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B8

.715 mm

1.57 mm

Not Qualified

1.57 mm

TPS65720YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

STHVDAC-253MF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

16

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B16

.655 mm

1.6 mm

NOT SPECIFIED

NOT SPECIFIED

1.7 mm

TLK2711AJRZQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B80

3

1 mm

5 mm

Not Qualified

e1

30

260

5 mm

BQ51025YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

HPA01195YFPR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BGU8004X

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.22 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

1

.32 mm

.44 mm

260

.65 mm

BGU8004Z

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.22 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

1

.32 mm

.44 mm

260

.65 mm

NRF51822-CEAA-R7

Nordic Semiconductor Asa

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

62

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

75 Cel

-25 Cel

BOTTOM

R-PBGA-B62

.55 mm

3.5 mm

NOT SPECIFIED

NOT SPECIFIED

3.83 mm

NRF51822-CFAC-R

Nordic Semiconductor Asa

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

62

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

75 Cel

-25 Cel

BOTTOM

S-PBGA-B62

.55 mm

3.83 mm

NOT SPECIFIED

NOT SPECIFIED

3.83 mm

NRF51822-CEAA-R

Nordic Semiconductor Asa

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

62

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

75 Cel

-25 Cel

BOTTOM

R-PBGA-B62

.55 mm

3.5 mm

NOT SPECIFIED

NOT SPECIFIED

3.83 mm

NRF51822-CFAC-R7

Nordic Semiconductor Asa

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

62

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

75 Cel

-25 Cel

BOTTOM

S-PBGA-B62

.55 mm

3.83 mm

NOT SPECIFIED

NOT SPECIFIED

3.83 mm

NRF51822-CDAB-R

Nordic Semiconductor Asa

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

75 Cel

-25 Cel

BOTTOM

R-PBGA-B56

1

.55 mm

3.33 mm

3.5 mm

TCP-4112UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.626 mm

STHVDAC-256MTGF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B20

.64 mm

1.94 mm

NOT SPECIFIED

NOT SPECIFIED

2.23 mm

TCP-4182UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

1.009 mm

HMC6300BG46

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

65

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B65

1

.815 mm

4 mm

30

260

6 mm

HMC6301BG46

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

75

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.35 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B75

1

.815 mm

4 mm

30

260

6 mm

EFR32BG1B232F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

EFR32BG1P332F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B43

1

.54 mm

3.143 mm

e1

40

260

3.295 mm

EFR32BG1V132F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

CC2564BYFVR-XI

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 Mbps

R-XBGA-B54

1

.575 mm

2.93 mm

e1

30

260

3.26 mm

CC2560BYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

CC2560BYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

NL3HS644FCTAG

Onsemi

TELECOM CIRCUIT

BALL

36

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

BOTTOM

S-PBGA-B36

.54 mm

2.34 mm

NOT SPECIFIED

NOT SPECIFIED

2.34 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.