NO LEAD Other Function Telecom Interface ICs 684

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SL869GNS117T001	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N24		2.4 mm	12.2 mm		NOT SPECIFIED	NOT SPECIFIED	16 mm
MGM111A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm	12.9 mm				15 mm
HPA00399RHDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.25 Mbps	S-PQCC-N28	3	1 mm	5 mm	e4	30	260	5 mm
BGM111A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES							3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.2 mm	12.9 mm				15 mm
HPA02243RGZR	Texas Instruments	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N48	3	1 mm	7 mm	e4	30	260	7 mm
AMW037	Silicon Labs	TELECOM CIRCUIT		NO LEAD	44	QMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XQMA-N44		2.72 mm	16.51 mm				24.77 mm
TUSB214QRWBTQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		.03 mA	3.3 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm	e4	30	260	1.6 mm
TUSB212QRWBRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1		AEC-Q100		.03 mA	3.3 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm	e4	30	260	1.6 mm
SI4060-B1B-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	e3	40	260	4 mm
ADC32RF82IRMPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.15 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N72	3	1 mm	10 mm	e4	30	260	10 mm
ADC32RF82IRMPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.15 V	CHIP CARRIER, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-PQCC-N72	3	1 mm	10 mm	e4	30	260	10 mm
TUSB214IRWBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	1				.03 mA	3.3 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	480.24 Mbps	S-PQCC-N12	2	.4 mm	1.6 mm	e4	30	260	1.6 mm
ATSAMB11-XR2100A	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	49	HLGA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.6 V	GRID ARRAY, HEAT SINK/SLUG			85 Cel	-40 Cel		BOTTOM		R-XBGA-N49		1.4 mm	4.5 mm				5.5 mm
RN4870U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3 V	MICROELECTRONIC ASSEMBLY			70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N30		1.6 mm	12 mm				15 mm
RN4871-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3 V	MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)	1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm				11.5 mm
MAX-8Q	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	18	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949			3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N18					NOT SPECIFIED	NOT SPECIFIED
ESP32-S0WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.35 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	5 mm				5 mm
ESP32-D2WD	Espressif Systems (Shanghai)	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.35 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	5 mm				5 mm
L80-M39	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		SQUARE	UNSPECIFIED	NO	1						3.3 V	MICROELECTRONIC ASSEMBLY		2.54 mm	85 Cel	-40 Cel		DUAL		S-XDMA-N12		7.05 mm	16 mm		NOT SPECIFIED	NOT SPECIFIED	16 mm
EFR32BG12P432F1024GM48-C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N48		.9 mm	7 mm				7 mm
BGM1033N7E6327XUSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						2.7 V	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		.54 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.77 mm	1.7 mm		NOT SPECIFIED	NOT SPECIFIED	2.3 mm
BGM15HA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						2.8 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm	e4			1.9 mm
BGM15MA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						2.8 V	CHIP CARRIER, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBCC-N12	1	.65 mm	1.1 mm				1.9 mm
BGS16GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBCC-N14	1	.65 mm	2 mm				2 mm
BGT24AR2E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	AEC-Q100			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm	e3			5.5 mm
BGT24AT2E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	AEC-Q100			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm	e3			5.5 mm
BGT24ATR12E6433XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR	AEC-Q100			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	125 Cel	-40 Cel	TIN	QUAD		R-PQCC-N32	3	.9 mm	4.5 mm	e3			5.5 mm
RN4870-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1						3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm				22 mm
ADL5335ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	4 mm	e4	30	260	4 mm
ADL5335ACPZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	4 mm	e4	30	260	4 mm
LMX8410RGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm	e4	30	260	7 mm
LMX8410RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm	e4	30	260	7 mm
PI3EQX1001XUAEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	18	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	70 Cel	0 Cel		QUAD		S-XQCC-N18		.4 mm	2 mm		NOT SPECIFIED	NOT SPECIFIED	2 mm
AX5031-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm	e3		260	4 mm
HMC773ALC3BTR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N12		.9 mm	2.9 mm		NOT SPECIFIED	NOT SPECIFIED	2.9 mm
LEA-6H-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28		RECTANGULAR	UNSPECIFIED	NO	1			AEC-Q100			3 V	MICROELECTRONIC ASSEMBLY		1.1 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N28		2.7 mm	17 mm		NOT SPECIFIED	NOT SPECIFIED	22.4 mm
HMC641ALP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				-3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24		.95 mm	4 mm		NOT SPECIFIED	NOT SPECIFIED	4 mm
HMC745LC3TR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD		S-CQCC-N16	3	.9 mm	2.9 mm				2.9 mm
AX-SFEU-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N40	1	1 mm	5 mm	e4		260	7 mm
AX5243-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm	e3		260	4 mm
AX5243-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	1 mm	4 mm	e3	30	260	4 mm
BGSF110GN26E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	26	HQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS				3 V	CHIP CARRIER, HEAT SINK/SLUG			85 Cel	-30 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		R-PQCC-N26	1	.77 mm	2.6 mm	e4			3.4 mm
LEA-6T-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949			3 V	SMALL OUTLINE			85 Cel	-40 Cel		DUAL		R-PDSO-N28
AX5042-1-TA05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				2.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-XQCC-N28	1	1 mm	5 mm	e4		260	5 mm
ST25TV16K-AP6G3	STMicroelectronics	TELECOM CIRCUIT		NO LEAD		DIE	ROUND	UNSPECIFIED	YES	1							UNCASED CHIP	DIE OR CHIP		85 Cel	-40 Cel		UNSPECIFIED	.053 Mbps	X-XUUC-N
ACFM-7037-TR1	Broadcom	TELECOM CIRCUIT		NO LEAD	15		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY						UNSPECIFIED		R-XXMA-N15		.8 mm	2 mm				3.6 mm
ZED-F9P-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	LGA	RECTANGULAR	UNSPECIFIED	YES	1			AEC-Q100			3 V	GRID ARRAY		1.1 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N54		2.6 mm	17 mm				22 mm
XB3-24Z8PS-J	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1							MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37					NOT SPECIFIED	NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.