NO LEAD Other Function Telecom Interface ICs 684

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

CC2560BRVMT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

76

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N76

3

.9 mm

8 mm

e3

30

260

8 mm

CC2564BRVMT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

76

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQCC-N76

3

.9 mm

7.73 mm

e3

30

260

8 mm

PGA5807ARGCR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N64

3

1 mm

9 mm

e4

30

260

9 mm

PGA5807ARGCT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N64

3

1 mm

9 mm

e4

30

260

9 mm

TCP-3027N-QT

Onsemi

TELECOM CIRCUIT

OTHER

NO LEAD

6

VQCCN

RECTANGULAR

UNSPECIFIED

YES

1

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

QUAD

R-XQCC-N6

1 mm

1.2 mm

1.6 mm

BGA711N7E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

2.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

DUAL

R-PDSO-N6

1

.4 mm

1.3 mm

e3

2 mm

BGM1034N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N7

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

BGS15AN16E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

QUAD

S-PQCC-N16

1

.77 mm

2.3 mm

e3

2.3 mm

HTMS1101FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

HTMS1201FUG/AM,005

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DIE

SQUARE

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

WAFER

Other Telecom ICs

85 Cel

-40 Cel

UPPER

S-XUUC-N

Not Qualified

HTMS1201FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

ADRF6820ACPZ-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N40

.8 mm

6 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

BGM1032N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

BGM1043N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

SKY13453-385LF

Skyworks Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

QCCN

SQUARE

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

90 Cel

-40 Cel

QUAD

S-XQCC-N6

1

.5 mm

1 mm

260

1 mm

PHY2078QT-BR

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

95 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

1

.8 mm

5 mm

e3

30

260

5 mm

CC2595RGTT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

3 mm

e4

30

260

3 mm

ADL5354ACPZ-R2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N36

1

1 mm

6 mm

Not Qualified

e3

6 mm

CC2430F64RTCRG3

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N48

3

.9 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC2430ZF128RTCG3

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N48

3

.9 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC2430ZF128RTCRG3

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N48

3

.9 mm

7 mm

Not Qualified

e4

30

260

7 mm

CMX992Q3

Cml Microcircuits

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

7 mm

ADN2917ACPZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

e3

260

4 mm

ADN2917ACPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

e3

4 mm

P5DF081HN/T1AD2060

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

e4

ABBTM-NVC-MDCS42A

Abracon

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N32

3

2.2 mm

13.4 mm

25.8 mm

STA8088GATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

7 mm

e3

40

260

7 mm

STA8088GA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

7 mm

e3

40

260

7 mm

PE4312MLBA-Z

Psemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N20

1

.9 mm

4 mm

e4

30

260

4 mm

LM15851NKER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

68

VQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, VERY THIN PROFILE

.45 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

4000 Mbps

S-XQCC-N68

3

1 mm

10 mm

1.995 V

e3

30

260

10 mm

TRF37A73IDSGT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e4

30

260

2 mm

CC8520RHAT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

5 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

AD8285WBCPZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N72

3

.9 mm

10 mm

e3

30

260

10 mm

AD8285WBCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

72

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N72

3

.9 mm

10 mm

e3

30

260

10 mm

ADN2913ACPZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

e3

260

4 mm

ADN2913ACPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N24

3

1 mm

4 mm

e3

260

4 mm

ADF7024BCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N32

3

.8 mm

5 mm

e4

30

260

5 mm

ALM-1912-BLKG

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

9

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N9

3

1.05 mm

2 mm

260

2.9 mm

ALM-1912-TR1G

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

9

QCCN

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

R-XQCC-N9

3

1.05 mm

2 mm

260

2.9 mm

MGA-43003-BLKG

Broadcom

TELECOM CIRCUIT

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N28

1 mm

5 mm

5 mm

MGA-43003-TR1G

Broadcom

TELECOM CIRCUIT

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N28

1 mm

5 mm

5 mm

CYRF7936-40LFXC

Cypress Semiconductor

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

1

2.4 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N40

3

1 mm

6 mm

Not Qualified

e3

20

260

6 mm

MRF24J40T-I/ML

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N40

1

1 mm

6 mm

Not Qualified

e3

40

260

6 mm

ZABG4002JA16TC

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

1

.65 mm

3 mm

Not Qualified

e4

30

260

3 mm

MAX2370ETM

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.087 mA

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N48

1

.8 mm

7 mm

Not Qualified

e0

7 mm

CC430F5133IRGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.2 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.5 Mbps

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC430F5133IRGZ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.2 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.5 Mbps

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC430F5135IRGZ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.2 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.5 Mbps

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.