THROUGH-HOLE Other Function Telecom Interface ICs 18

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
XR2211ACP-F	Exar	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.009 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDIP-T14		5.33 mm	7.62 mm	Not Qualified	e3			19.305 mm
RI-STU-MRD1-30	Texas Instruments	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	30		RECTANGULAR	UNSPECIFIED	NO	1				5 V		MICROELECTRONIC ASSEMBLY				50 Cel	-20 Cel		DUAL		R-XDMA-T30
L3845B	STMicroelectronics	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				20 V	20	IN-LINE	DIP8,.3	Analog Transmission Interfaces	2.54 mm	70 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T8		5.08 mm	7.62 mm	Not Qualified	e3
AD974AN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified	e0			36.687 mm
AD974BN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified	e0			36.687 mm
AN7580	Panasonic	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	12	SIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			12 V		IN-LINE				75 Cel	-25 Cel		SINGLE		R-PSIP-T12				Not Qualified
SA602AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
SA612AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
MCP2140A-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	TS 16949		3 V		IN-LINE	DIP18,.3		2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T18		5.334 mm	7.62 mm	Not Qualified	e3			22.86 mm
SA612AN,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		40	250	9.5 mm
AD974BNZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified	e3			36.687 mm
TL851CNE4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			5 V		IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	40 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16	1	5.08 mm	7.62 mm	Not Qualified	e4			19.305 mm
TL852CNE4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR			5 V		IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	40 Cel	0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16	1	5.08 mm	7.62 mm	Not Qualified	e4			19.305 mm
RN41XVC-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-T20	1	2 mm	24.4 mm					29.9 mm
RN41XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm		e4			29.9 mm
RN42XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm		e4			29.9 mm
ADCA3990AMLZ	Analog Devices	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	9		RECTANGULAR	UNSPECIFIED	NO	1						FLANGE MOUNT				100 Cel	-30 Cel		SINGLE		R-XSFM-T9						NOT SPECIFIED	NOT SPECIFIED
XB24CASIT-001	Digi International	TELECOM CIRCUIT		THROUGH-HOLE	20	XMA	UNSPECIFIED	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	X-XXMA-T20			24.38 mm					27.61 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.