NXP Semiconductors Other Function Telecom Interface ICs 155

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HTMS8101FTB/AF,115	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	3	QCCN		PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs					QUAD			1			Not Qualified			260
HTMS8101FTK/AF,115	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD		QCCN		PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LCC(UNSPEC)	Other Telecom ICs					QUAD			1			Not Qualified			260
HTMS8201FTB/AF,115	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	3	QCCN		PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs					QUAD			1			Not Qualified			260
HTMS8201FTK/AF,115	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD		QCCN		PLASTIC/EPOXY	YES		CMOS					CHIP CARRIER	LCC(UNSPEC)	Other Telecom ICs					QUAD			1			Not Qualified			260
SL3ICS3001FW/V1,00	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL														DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
HTCICC6402FUG/AM,0	NXP Semiconductors	TELECOM CIRCUIT												5 V	5		DIE OR CHIP	Other Telecom ICs											Not Qualified
HTCICC6403FUG/AM,0	NXP Semiconductors	TELECOM CIRCUIT												5 V	5		DIE OR CHIP	Other Telecom ICs											Not Qualified
PN5120A0HN/C1,551	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified	e4	30	260
PN5120A0HN/C1,557	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified	e4	30	260
PN5120A0HN/C2,518	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified	e4	30	260
PN5120A0HN/C2,551	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified	e4	30	260
SL3S1002AC2,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL														DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
SL3S1202AC2,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL														DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
SL3S1203AC0,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL										.265 mA	1.8 V	1.8		DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
SL3S1203AC2,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL										.265 mA	1.8 V	1.8		DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
PN512AA0HN1/C2,551	NXP Semiconductors		OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			AEC-Q100	100 mA		1.8/3.3,2.5/3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	3			Not Qualified			260
BGX7100HN/1,118	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES					5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
BGX7100HN/1,115	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES					5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
MFRC63102HN,157	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	.4 Mbps	S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
SL3S1213FUD/BG,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL								CMOS		.265 mA	1.8 V	1.8		DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
HT2MOA2S20/E/3,118	NXP Semiconductors	TELECOM CIRCUIT						PLASTIC/EPOXY			HYBRID					MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs											Not Qualified
PRH601HL/C1,557	NXP Semiconductors		OTHER	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES						3.3,5	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	-25 Cel		QUAD		S-PQFP-G100	3			Not Qualified			260
HT1ICS3002W/V6F,00	NXP Semiconductors	TELECOM CIRCUIT	OTHER														WAFER	Other Telecom ICs		85 Cel	-25 Cel								Not Qualified
SL3S4011FHK,125	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N8	1			Not Qualified		30	260
SL3S4021FHKH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N8	1			Not Qualified	e4	30	260
PN5120A0ET/C2J	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified			260
PN5120A0ET/C2EL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified			260
PN5120A0ET/C2QL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified			260
CLRC66302HN,157	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	1 Mbps	S-PQCC-N32	1	1 mm	5 mm			30	260	5 mm
SL3S1204FTB0X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE	SOLCC6,.04,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6				Not Qualified
SL3ICS1002FUG/V7AF	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
SL3ICS1202FUG/V7AF	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
MFRC53001T/0FE,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm				250	20.5 mm
SA606DK/03,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
HTMS1101FTB/AF,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE	LCC3(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel		DUAL		R-PDSO-N3		.5 mm	1 mm	Not Qualified				1.45 mm
HTMS1201FUG/AM,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	SQUARE	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP	WAFER	Other Telecom ICs		85 Cel	-40 Cel		UPPER		S-XUUC-N				Not Qualified
HTMS1201FTB/AF,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE	LCC3(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel		DUAL		R-PDSO-N3		.5 mm	1 mm	Not Qualified				1.45 mm
P5DF081HN/T1AD2060	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32					e4
HT2DC20S20/F,122	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	PLASTIC/EPOXY	YES	1	HYBRID					SPECIAL SHAPE	MODULE(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel		UNSPECIFIED		R-PXSS-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
HTRC11001T/02EE,11	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.01 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1		4 mm	Not Qualified	e4	30	260	8.75 mm
HTSFCH4801EV/DH,11	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	UPPER		X-XUUC-N				Not Qualified	e4
HTSMOH3201EV,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified
HTSMOH5601EV,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel	SILVER	UPPER		X-XUUC-N				Not Qualified	e4
PN5110A0HN1/C2,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified	e4			5 mm
PN5110A0HN1/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified	e4			5 mm
PN5120A0HN1/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified	e4		260	5 mm
SA5211D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
SA5211D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.