| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Onsemi |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
-30 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
e6 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
OTHER |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
-30 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
e6 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
COMMERCIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
.04 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
-20 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G16 |
3 |
Not Qualified |
e6 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
OTHER |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BIPOLAR |
.032 mA |
5 V |
5 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.3 |
Other Telecom ICs |
.635 mm |
70 Cel |
-30 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G24 |
3 |
Not Qualified |
e6 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
80 Cel |
-40 Cel |
TIN |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
52 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC52,.31SQ,20 |
Modems |
.5 mm |
80 Cel |
-40 Cel |
QUAD |
S-XQCC-N52 |
1 mm |
8 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
52 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC52,.31SQ,20 |
Modems |
.5 mm |
80 Cel |
-40 Cel |
QUAD |
S-XQCC-N52 |
1 mm |
8 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
e3 |
10.3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
2 |
2.65 mm |
7.5 mm |
e3 |
260 |
10.3 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
e3 |
10.3 mm |
|||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
2 |
2.65 mm |
7.5 mm |
e3 |
30 |
260 |
10.3 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
VSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
SMALL OUTLINE, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
DUAL |
R-XDSO-N6 |
1 mm |
1.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
R-XQCC-N6 |
1 mm |
1.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
R-XQCC-N6 |
1 mm |
1.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
R-XQCC-N6 |
1 mm |
1.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
R-XQCC-N6 |
1 mm |
1.2 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.6 mm |
||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
20 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-PBGA-B20 |
.65 mm |
2.23 mm |
2.58 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
R-XQCC-N6 |
1 mm |
1.2 mm |
1.6 mm |
|||||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.08 mA |
3.3 V |
3.3 |
CHIP CARRIER |
LDCC28,.5SQ |
Modems |
1.27 mm |
80 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J28 |
3 |
4.572 mm |
11.506 mm |
Not Qualified |
e3 |
30 |
260 |
11.506 mm |
|||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.2 mA |
1.8 V |
1.8/2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.0008 mA |
3 V |
3,5 |
CHIP CARRIER |
LCC44,.28SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
.03125 Mbps |
S-XQCC-N44 |
3 |
.9 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
44 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
.0008 mA |
3 V |
3,5 |
CHIP CARRIER |
LCC44,.28SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.03125 Mbps |
S-XQCC-N44 |
3 |
.9 mm |
7 mm |
Not Qualified |
e3 |
30 |
260 |
7 mm |
|||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
e4 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
NICKEL PALLADIUM GOLD |
1 |
e4 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.42 mm |
85 Cel |
-30 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B4 |
1 |
.345 mm |
.609 mm |
e4 |
260 |
.626 mm |
||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
OTHER |
BALL |
4 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.42 mm |
85 Cel |
-30 Cel |
NICKEL GOLD |
BOTTOM |
R-PBGA-B4 |
1 |
.345 mm |
.609 mm |
e4 |
260 |
1.009 mm |
||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
BOTTOM |
S-PBGA-B36 |
.54 mm |
2.34 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.34 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.16SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
4 mm |
e3 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
30 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G30 |
4 |
1.5 mm |
5.6 mm |
e6 |
30 |
260 |
9.75 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
30 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G30 |
4 |
1.5 mm |
5.6 mm |
e6 |
30 |
260 |
9.75 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N40 |
1 |
1 mm |
5 mm |
e4 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
4 mm |
e3 |
260 |
4 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
1 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-XQCC-N28 |
1 |
1 mm |
5 mm |
e4 |
260 |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
UNCASED CHIP |
DIE OR CHIP |
85 Cel |
-40 Cel |
UPPER |
2 Mbps |
X-XUUC-N |
DATA RATE 350 KBPS FOR FSK,MODULATION |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.25 Mbps |
S-XQCC-N28 |
1 mm |
5 mm |
e4 |
5 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.27,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
.0006 Mbps |
R-PQCC-N40 |
1 mm |
5 mm |
e4 |
7 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC28,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
.125 Mbps |
S-XQCC-N28 |
1 |
1 mm |
5 mm |
30 |
260 |
5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.