STMicroelectronics Other Function Telecom Interface ICs 52

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

STA8058

STMicroelectronics

INDUSTRIAL

BALL

104

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.7,3.3

GRID ARRAY, FINE PITCH

BGA104,8X13,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B104

Not Qualified

ST7590T

STMicroelectronics

INDUSTRIAL

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

30 mA

18 V

18

FLATPACK

TQFP100,.63SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

QUAD

S-PQFP-G100

3

Not Qualified

e1

30

260

CRX14-MQP/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

20 mA

5 V

5

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-20 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G16

3

Not Qualified

e4

30

260

ST7570TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

ST7570

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQFP-G48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

STA5620CTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

VQCCN

SQUARE

1

BICMOS

2.7 V

.5 mm

85 Cel

-40 Cel

TIN

3

1 mm

5 mm

e3

30

260

5 mm

ST7580TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

CHIP CARRIER

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

STA5630ATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

STA5630TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Silver (Ag)

QUAD

S-XQCC-N32

3

1 mm

5 mm

e4

30

260

5 mm

BLUENRGQTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

STS1TXQTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

1 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

L3845B

STMicroelectronics

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

20 V

20

IN-LINE

DIP8,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T8

5.08 mm

7.62 mm

Not Qualified

e3

L3845D1013TR

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

70 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

STA8088GATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

7 mm

e3

40

260

7 mm

STA8088GA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

7 mm

e3

40

260

7 mm

STPAC01F2

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

8

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B8

.715 mm

1.57 mm

Not Qualified

1.57 mm

SN250QT

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

SN250Q

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

40

260

7 mm

STA5620TR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.019 mA

2.7 V

2.7

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

STMPE610QTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

1

1 mm

3 mm

Not Qualified

e3

30

260

3 mm

MP45DT02TR-M

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

6

LGA

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-XBGA-N6

3

1.35 mm

3.76 mm

e4

260

4.72 mm

STA311B

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

90 Cel

-40 Cel

QUAD

S-XQCC-N56

1 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

STHVDAC-253MF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

16

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B16

.655 mm

1.6 mm

NOT SPECIFIED

NOT SPECIFIED

1.7 mm

TDA7541W

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TDA7541

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

STLC60845

STMicroelectronics

TELECOM CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B292

Not Qualified

CR14-MQP/1GE

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.02 mA

5 V

5

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-20 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

STA2500DCTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B48

1.25 mm

6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6 mm

STA2500DC

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B48

1.25 mm

6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6 mm

STA2500DTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B48

3

1.25 mm

6 mm

Not Qualified

e1

30

260

6 mm

STA2500D

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.75 V

2.75

GRID ARRAY

BGA48,7X7,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B48

3

1.25 mm

6 mm

Not Qualified

e1

30

260

6 mm

STA020DJTR

STMicroelectronics

TELECOM CIRCUIT

COMMERCIAL

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

3

2.65 mm

7.5 mm

e4

260

15.4 mm

STA8088G

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

AEC-Q100

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.9 mm

7 mm

7 mm

LNBH26LSPQR

STMicroelectronics

TELECOM CIRCUIT

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

12 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

QUAD

S-XQCC-N24

1

1 mm

4 mm

4 mm

SPSGRF-868

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

11

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N11

2.2 mm

11.5 mm

NOT SPECIFIED

NOT SPECIFIED

13.5 mm

SPBTLE-RF

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

11

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N11

2.2 mm

11.5 mm

NOT SPECIFIED

NOT SPECIFIED

13.5 mm

STHVDAC-256MTGF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B20

.64 mm

1.94 mm

NOT SPECIFIED

NOT SPECIFIED

2.23 mm

STA8090GATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

.9 mm

8 mm

e3

250

8 mm

STA8090GA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.9 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

STA8090FGBTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

99

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B99

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

STA8090FGTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

99

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B99

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

STA8090FG

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

99

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B99

1.2 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

6 mm

SPWF04SA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N30

2.3 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

SPWF04SC

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

30

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.524 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N30

2.3 mm

15.24 mm

NOT SPECIFIED

NOT SPECIFIED

26.924 mm

STA8090EXGAJTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGAJ

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B169

3

1.2 mm

9 mm

e3

260

9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.