Texas Instruments Other Function Telecom Interface ICs 306

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC2560BYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1	.575 mm	2.925 mm			e1	30	260	3.265 mm
LMX8410RGZR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
LMX8410RGZT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	3	1 mm	7 mm			e4	30	260	7 mm
ADS58J64IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1	1.15 V	CHIP CARRIER, HEAT SINK/SLUG			85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N72	3				2 V	e4	30	260
AFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000		e1	30	260	17 mm
ADC32RF83IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
ADC32RF80IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
ADC32RF83IRRHT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
ADC32RF80IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	1.15 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	12500 Mbps	S-XQCC-N72	3	.9 mm	10 mm			e4	30	260	10 mm
AFE8092IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500		e1	30	260	17 mm
AFE7903IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.925 V	GRID ARRAY	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz		e1		260	17 mm
CC400DBR	Texas Instruments	TELECOM CIRCUIT		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	3 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	.65 mm	85 Cel	-30 Cel		DUAL	.0096 Mbps	R-PDSO-G28		2 mm	5.3 mm						10.2 mm
AFE7903IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1	.925 V	GRID ARRAY	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz		e0		220	17 mm
AFE8092HIABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500		e1		260	17 mm
AFE7952IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm			TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000		e1		260	17 mm
AFE8000IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1		GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Max)(MHz) : 7000		e1		260	17 mm
AFE7901IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	.925 V	GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			e0		220	17 mm
AFE7901IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	.925 V	GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm			e1		260	17 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.