Other Function Telecom Interface ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ONET8501TY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	19	DIE	RECTANGULAR	UNSPECIFIED	YES	1				44 mA	3.3 V		UNCASED CHIP				100 Cel	-40 Cel		UPPER	11300 Mbps	R-XUUC-N19				Not Qualified	Data rate is 11.3 Gbps		NOT SPECIFIED	NOT SPECIFIED
AMIS-49250-XTD	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1	.0008 mA	3 V	3,5	CHIP CARRIER	LCC44,.28SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	TIN	QUAD	.03125 Mbps	S-XQCC-N44	3	.9 mm	7 mm	Not Qualified		e3	30	260	7 mm
AMIS-49250-XTP	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1	.0008 mA	3 V	3,5	CHIP CARRIER	LCC44,.28SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.03125 Mbps	S-XQCC-N44	3	.9 mm	7 mm	Not Qualified		e3	30	260	7 mm
XRT85L61IG-F	Exar	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified		e3			9.7 mm
AD9993BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.4 mm	12 mm				30	260	12 mm
RI-TRP-R4FF-30	Texas Instruments	TELECOM CIRCUIT	OTHER				UNSPECIFIED	UNSPECIFIED		1											50 Cel	-25 Cel											NOT SPECIFIED	NOT SPECIFIED
RI-TRP-W4FF-30	Texas Instruments	TELECOM CIRCUIT	OTHER				UNSPECIFIED	UNSPECIFIED		1											50 Cel	-25 Cel											NOT SPECIFIED	NOT SPECIFIED
MRF24WB0MA/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V	3.3	UNCASED CHIP	MODULE,36LEAD,.8	Other Telecom ICs		70 Cel	0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified		e3
MRF24WB0MB/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1					3.3 V		UNCASED CHIP				70 Cel	0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified		e3
HTRM800/AED,122	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY				-15 V		.55 mA	15 V	+-15	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel								Not Qualified
UAA3201T/V1,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES							3.5/6	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16				Not Qualified
UAA3220TS/V1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		2 mm	5.3 mm						8.2 mm
PN5110A0HN1/C2,157	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			.1 mA	3 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4	30	260	5 mm
PN5120A0HN1/C1,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
SA5211D,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.031 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified			40	260	8.65 mm
SA5212AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.033 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified			40	260	4.9 mm
SA602AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
SA606DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified			40	260	6.5 mm
SA606DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
SA612AN,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified			40	250	9.5 mm
SA636DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified			40	260	6.5 mm
SA636DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified			40	260	7.8 mm
SA647DH,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4			6.5 mm
SA647DH,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.1 mm	4.4 mm	Not Qualified					6.5 mm
AD9364BBCZREEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1	30	260	10 mm
AD9364BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144	3	1.7 mm	10 mm			e1	30	260	10 mm
SST12LP17E-QU8E	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	3	.6 mm	2 mm			e3			2 mm
MP45DT02TR-M	STMicroelectronics	TELECOM CIRCUIT	OTHER	NO LEAD	6	LGA	RECTANGULAR	UNSPECIFIED	YES	1					1.8 V		GRID ARRAY				85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-XBGA-N6	3	1.35 mm	3.76 mm			e4		260	4.72 mm
MRF24J40MDT-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1					3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N12		3.3528 mm	22.86 mm			e3			33.02 mm
STA311B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	90 Cel	-40 Cel		QUAD		S-XQCC-N56		1 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm	1.6 mm				NOT SPECIFIED	NOT SPECIFIED	1.7 mm
XCC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1					3.6 V		CHIP CARRIER				70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm						7 mm
ALM-GN001-BLKG	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.9 mm	1.7 mm						2.3 mm
ALM-GN001-TR1G	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1					1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.54 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.9 mm	1.7 mm						2.3 mm
SI4330-B1-FMR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm	Not Qualified		e3	40	260	4 mm
CC2531F128RHAR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
CC2531F128RHAT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
TLK2711AIRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2711AIRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified		e1	30	260	5 mm
ONET8501PBRGTT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	100 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	11300 Mbps	S-PQCC-N16	2	1 mm	3 mm	Not Qualified		e4	NOT SPECIFIED	260	3 mm
SN761634RTWR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	.8 mm	4 mm	Not Qualified		e4	30	260	4 mm
TDA7541W	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				8.5 V		FLATPACK				85 Cel	-40 Cel		QUAD		S-PQFP-G64				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
TDA7541	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				8.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10 mm
TDA7255V	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3 V	2.5/5	CHIP CARRIER, VERY THIN PROFILE	LCC40,.22X.26,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		R-PQCC-N40		.9 mm	5.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	6.5 mm
ADF9010BCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			.41 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3		260	7 mm
ADF9010BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			.41 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified		e3		260	7 mm

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.