Other Function Telecom Interface ICs

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ST60-2230C	Laird Technologies	TELECOM CIRCUIT
ST60-2230C-UU	Laird Technologies	TELECOM CIRCUIT
XB24CASIT-001	Digi International	TELECOM CIRCUIT		THROUGH-HOLE	20	XMA	UNSPECIFIED	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY		2 mm	85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	X-XXMA-T20			24.38 mm					27.61 mm
AD9988BBPZRL-4D4AC	Analog Devices	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	120 Cel	-40 Cel		BOTTOM		S-PBGA-B324		1.72 mm	15 mm					15 mm
XB3-24APS-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AST-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24ARS	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AST	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24APS	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24APT	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUT	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUT-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
XB3-24AUM-J	Digi International	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1				SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X
ADRV9002BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32	.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
ADRV9002BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32	.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
ENW89829C3KF	Panasonic	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.6 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	2.178 Mbps	R-XXMA-N24		2 mm	6.5 mm					9 mm
ESP32-D0WDQ6-V3	Espressif Systems (Shanghai)	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	.4 mm	125 Cel	-40 Cel		QUAD	150 Mbps	S-XQCC-N48		.9 mm	6 mm					6 mm
AFE8092IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500	e1	30	260	17 mm
ADRF5519BCPZN	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADRF5519BCPZN-RL	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
BT832	Fanstel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	XMA	RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-N40			14 mm					16 mm
D52MD2M8IA-TRAY	Garmin Canada	TELECOM CIRCUIT	INDUSTRIAL	BALL	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY		1.5 mm	85 Cel	-40 Cel		UNSPECIFIED	.06 Mbps	R-XXMA-B35		2.11 mm	9.8 mm					14 mm
ADRV9004BBCZ-RL	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2			1 V	GRID ARRAY		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.25 mm	12 mm			30	260	12 mm
ADRV9004BBCZ	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2			1 V	GRID ARRAY		.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.25 mm	12 mm			30	260	12 mm
FC20N-Q73B	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	52	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	433 Mbps	R-XXMA-N52		2.1 mm	13 mm	Seated Hgt-Nom				16.6 mm
ZM3102AU-CME1R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY						UNSPECIFIED	.04 Mbps	R-XXMA-N18
ZM3102AE-CME1	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY						UNSPECIFIED	.04 Mbps	R-XXMA-N18
PN7160B1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20	.5 mm	85 Cel	-25 Cel		QUAD	.848 Mbps	S-PQCC-N40	3	1 mm	6 mm	ALSO AVAILABLE WTH 3.3 SUPPLY			260	6 mm
NPORT5110	Moxa	SERIAL DEVICE SERVER		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY			55 Cel	0 Cel		UNSPECIFIED		R-XXMA-X
AFE7903IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e1		260	17 mm
ATA8710-GHQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	32		SQUARE	UNSPECIFIED	YES	1			5 V		LCC32(UNSPEC)		85 Cel	-40 Cel		QUAD	.08 Mbps	S-XQCC-N32
CC400DBR	Texas Instruments	TELECOM CIRCUIT		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	.65 mm	85 Cel	-30 Cel		DUAL	.0096 Mbps	R-PDSO-G28		2 mm	5.3 mm					10.2 mm
BC57G687C-ANN-E4	Qualcomm	TELECOM CIRCUIT		BALL	105	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA105,11X11,32	.8 mm	85 Cel	-40 Cel		BOTTOM	12 Mbps	S-PBGA-B105		1.6 mm	10 mm					10 mm
AFE7903IALK	Texas Instruments	TELECOM CIRCUIT		BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1			.925 V	GRID ARRAY	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz	e0		220	17 mm
AFE8092HIABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500	e1		260	17 mm
BB-485LDRC9	Advantech	TELECOM CIRCUIT		UNSPECIFIED		XMA	UNSPECIFIED	PLASTIC/EPOXY	NO	1				MICROELECTRONIC ASSEMBLY			80 Cel	-40 Cel		UNSPECIFIED	.1152 Mbps	X-PXMA-X		78.8 mm	25.1 mm					95.2 mm
ESP32-WROVER-IB	Espressif Systems (Shanghai)	TELECOM CIRCUIT		NO LEAD	38	DMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL	150 Mbps	R-XDMA-N38		3.45 mm	18 mm					31.4 mm
BG95M5LA-64-SGNS	Quectel Wireless Solutions	TELECOM CIRCUIT		NO LEAD	102	LGA	RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	GRID ARRAY	LGA102(UNSPEC)		75 Cel	-35 Cel		BOTTOM	1.119 Mbps	R-XBGA-N102		2.2 mm	19.9 mm					23.6 mm
MDBT50Q-P1MV2	Raytac	TELECOM CIRCUIT		NO LEAD	61	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	2 Mbps	R-XXMA-N61		2 mm	10.5 mm					15.5 mm
AFE7952IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm			TIN SILVER COPPER	BOTTOM	29500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000	e1		260	17 mm
WT11U-A-AI4	Silicon Labs	TELECOM CIRCUIT		NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	NO	1	CMOS		3.3 V	MICROELECTRONIC ASSEMBLY		1.5 mm	85 Cel	-40 Cel		DUAL	3 Mbps	R-XDMA-N28		2.7 mm	14.5 mm					35.75 mm
AFE8000IABJ	Texas Instruments	TELECOM CIRCUIT		BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH	BGA400,20X20,32	.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	32500 Mbps	S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Max)(MHz) : 7000	e1		260	17 mm
XB9X-DMUS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XB9X-DMUS-031	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XBP9X-DMRS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XB9X-DMRS-001	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XB9X-DMUS-011	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37
XBP9X-DMRS-021	Digi International	TELECOM CIRCUIT		NO LEAD	37	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N37

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.