RECTANGULAR Telecom - Switching ICs 8

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
M34116B1	STMicroelectronics	CONFERENCING CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		50 mA	5 V	5	IN-LINE	DIP24,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T24			15.24 mm	Not Qualified		e0
KSZ8873MLLV	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.8 V		FLATPACK, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8895FQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8895FQXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8895MQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8895RQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3	30	260	20 mm
KSZ8895RQXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128	1	3.4 mm	14 mm			e3	30	260	20 mm
SJA1110BEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		ISO 26262; AEC-Q100		1.8 V		GRID ARRAY							BOTTOM	R-PBGA-B256	3				ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY			260

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.