BALL Telecom - Switching ICs 19

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Peak Reflow Temperature (C)	Length
VSC7429XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B672		2.44 mm	27 mm		e1		27 mm
VSC7425XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC7427XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
BCM53115MIPB	Broadcom	ETHERNET TRANSCEIVER		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY	BGA484,22X22,40	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B484		2.43 mm	23 mm				23 mm
BCM53115MKPBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY	BGA484,22X22,40	1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B484		2.43 mm	23 mm				23 mm
VSC7420XJG-02	Microchip Technology	ETHERNET SWITCH	OTHER	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	0 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC7420XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC7421XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC7422XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V	GRID ARRAY	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC7423XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm				27 mm
VSC7428XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC7428XJG-12	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm				27 mm
VSC7436XMT	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3300 mA	1 V	GRID ARRAY	BGA324,18X18,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.8 mm	19 mm				19 mm
VSC7513XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm				17 mm
VSC7424XJG-02	Microchip Technology	ETHERNET SWITCH		BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2000 mA	1 V	GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.36 mm	27 mm				27 mm
VSC7514XKS	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1800 mA	1 V	GRID ARRAY	BGA256,16X16,40	1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B256		1.8 mm	17 mm				17 mm
BCM56072A0KFSBG	Broadcom	ETHERNET SWITCH		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		23846.4 mA	.88 V	GRID ARRAY, FINE PITCH	BGA896,30X30,32	.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B896		2.768 mm	25 mm		e1		25 mm
SJA1110BEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		ISO 26262; AEC-Q100		1.8 V	GRID ARRAY						BOTTOM	R-PBGA-B256	3			ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY		260
SJA1110CEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262		1.8 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	.8 mm				BOTTOM	S-PBGA-B256	3	1.5 mm	14 mm	ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY		260	14 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.