GULL WING Telecom - Switching ICs 22

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD8150ASTZ	Analog Devices	DIGITAL TIME SWITCH	OTHER	GULL WING	184	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.45 mA	3.3 V	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP184,.87SQ,16	Other Telecom ICs	.4 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G184	3	1.6 mm	20 mm	Not Qualified	e3		260	20 mm
KSZ8895MLUB-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100; TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm		e3			14 mm
KSZ8873MLLV	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	TS 16949		1.8 V		FLATPACK, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G64		1.6 mm	10 mm		e3			10 mm
LAN9353/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm		e3			10 mm
LAN9353T/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm		e3			10 mm
LAN9353TI/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm		e3			10 mm
LAN9355/PT	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm			NOT SPECIFIED	NOT SPECIFIED	12 mm
LAN9355I/PT	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.2 mm	12 mm		e3			12 mm
KSZ8895FQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm		e3			20 mm
KSZ8895FQXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm		e3			20 mm
KSZ8895MLXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm		e3			14 mm
KSZ8895MQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm		e3			20 mm
KSZ8895RQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128		3.4 mm	14 mm		e3	30	260	20 mm
KSZ8567RTXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128	3	1.2 mm	14 mm		e3		260	14 mm
KSZ9567STXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128	3	1.2 mm	14 mm		e3		260	14 mm
KSZ9896CTXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.2 mm	14 mm		e3			14 mm
KSZ8873MLLAM-TR	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	12 mm			30	260	12 mm
LAN9352/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
LAN9352I/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
LAN9352T/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
KSZ8895RQXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128	1	3.4 mm	14 mm		e3	30	260	20 mm
ZL50023QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		130 mA	1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G256		1.6 mm	28 mm					28 mm

Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.