Telecom - Switching ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LAN9352I/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
LAN9352T/PT	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ	.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm					12 mm
LAN9352TI/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N72		1 mm	10 mm					10 mm
KSZ8895RQXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V	FLATPACK, FINE PITCH	QFP128,.68X.91,20	.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128	1	3.4 mm	14 mm		e3	30	260	20 mm
KSZ8864CNXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16	.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		e3	30	260	8 mm
BCM56072A0KFSBG	Broadcom	ETHERNET SWITCH		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		23846.4 mA	.88 V	GRID ARRAY, FINE PITCH	BGA896,30X30,32	.8 mm	70 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-PBGA-B896		2.768 mm	25 mm		e1			25 mm
ZL50023QCG1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	GULL WING	256	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			130 mA	1.8 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16	.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G256		1.6 mm	28 mm					28 mm
SJA1110BEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		ISO 26262; AEC-Q100		1.8 V	GRID ARRAY						BOTTOM	R-PBGA-B256	3			ALSO OPERATES WITH NOMINAL 2.5V AND 3.3V SUPPLY			260
SJA1110CEL/0Y	NXP Semiconductors	ETHERNET SWITCH		BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262		1.8 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	.8 mm				BOTTOM	S-PBGA-B256	3	1.5 mm	14 mm	ALSO OPERATES WITH 2.5V AND 3.3V NOMINAL SUPPLY			260	14 mm

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.