Aluminium Heat Sinks 17

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

630-45AB

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.449 in (11.4 mm)

1.378 in (35 mm)

Anodized

Black

6.81 g

1.378 in (35 mm)

658-35AB-T4

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.35 in (8.89 mm)

1.21 in (30.73 mm)

Anodized

Black

1.21 in (30.73 mm)

680-125220

Wakefield-vette

Heat Sink

Aluminium

Omnidirectional

1.252 in (31.8 mm)

1.811 in (46 mm)

Anodized

Black

49.9 g

1.811 in (46 mm)

680-5A

Wakefield-vette

Heat Sink

Aluminium

Omnidirectional

0.5 in (12.7 mm)

1.811 in (46 mm)

Anodized

Black

31.75 g

1.811 in (46 mm)

FA-T220-25E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1 in (25.4 mm)

0.984 in (25 mm)

Anodized

Black

17.5 g

1.638 in (41.6 mm)

FA-T220-38E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1.5 in (38.1 mm)

0.984 in (25 mm)

Anodized

Black

27 g

1.638 in (41.6 mm)

FA-T220-51E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

2 in (50.8 mm)

0.984 in (25 mm)

Anodized

Black

37 g

1.638 in (41.6 mm)

FA-T220-64E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

2.5 in (63.5 mm)

0.984 in (25 mm)

Anodized

Black

46 g

1.638 in (41.6 mm)

RA-T2X-25E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1 in (25.4 mm)

0.984 in (25 mm)

Anodized

Black

25 g

1.654 in (42 mm)

RA-T2X-38E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1.5 in (38.1 mm)

0.984 in (25 mm)

Anodized

Black

38 g

1.654 in (42 mm)

DA-T263-101E

Ohmite Manufacturing

Heat Sink

Aluminium

Transistor

Extruded

Fin Pin

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Anodized

Black

Bulk

3.8 g

1.02 in (25.91 mm)

258

Wakefield Thermal Solutions

Heat Sink

U

Aluminium

0.339 in (8.6 mm)

0.252 in (6.4 mm)

Anodized

Black

820 mg

0.5 in (12.7 mm)

302NN

Wakefield-vette

Heat Sink

Aluminium

Extruded

1.5 in (38.1 mm)

2 in (50.8 mm)

Anodized

Black

60.33 g

2 in (50.8 mm)

527-24AB-MS4

Wakefield-vette

Heat Sink

Aluminium

Extruded

0.24 in (6.1 mm)

2.28 in (57.9 mm)

Anodized

Black

2.402 in (61 mm)

625-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.984 in (25 mm)

Anodized

Black

5.45 g

0.984 in (25 mm)

3-1542003-4

TE Connectivity

Heat Sink

Clip

Aluminium

IC

Radial

UL

15 W

V4330N

Assmann Wsw Components

Heat Sink

Aluminium

Longitudinal

12 Ω

0.472 in (12 mm)

0.787 in (20 mm)

Black Anodized

Black

1.142 in (29 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.