Aluminium Alloy Heat Sinks 12

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

1963856-1

TE Connectivity

Heat Sink

Clip/Screw

Aluminium Alloy

Fin

Longitudinal

0.404 in (10.27 mm)

3.37 in (85.6 mm)

Anodized

4.39 in (111.5 mm)

DV-T263-101E

Ohmite Manufacturing

Heat Sink

Aluminium Alloy

Semiconductor

Extruded

Fin Pin

0.4 in (10.16 mm)

0.5 in (12.7 mm)

Bulk

3.8 g

1.02 in (25.91 mm)

904-27-1-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Elliptical Fin

12.93 Ω

0.906 in (23 mm)

1.063 in (27 mm)

Black Anodized

1.063 in (27 mm)

906-31-2-21-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

12.02 Ω

0.827 in (21 mm)

1.22 in (31 mm)

Black Anodized

1.22 in (31 mm)

906-31-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

12.02 Ω

0.906 in (23 mm)

1.22 in (31 mm)

Black Anodized

1.22 in (31 mm)

908-35-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

10.03 Ω

0.472 in (12 mm)

1.378 in (35 mm)

Black Anodized

1.378 in (35 mm)

910-40-1-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Elliptical Fin

9.95 Ω

0.906 in (23 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

910-40-2-23-2-B-0

Wakefield Thermal Solutions

Heat Sink

Clip

Aluminium Alloy

IC

Extruded

Pin Fin

9.18 Ω

0.472 in (12 mm)

1.575 in (40 mm)

Black Anodized

1.575 in (40 mm)

30182

Vicor

Heat Sink

Aluminium Alloy

Extruded

0.909 in (23.1 mm)

2.22 in (56.4 mm)

2.28 in (57.9 mm)

APF40-40-13CB/A01

Cts

Heat Sink

Adhesive

Aluminium Alloy

IC

9.9 Ω

0.5 in (12.7 mm)

1.575 in (40 mm)

Anodized

Black

1.575 in (40 mm)

CR101-75AE

Ohmite Manufacturing

Heat Sink

Clip

Aluminium Alloy

Extruded

4.2 Ω

1.969 in (50 mm)

1.063 in (27 mm)

Anodized

Black

85 g

2.953 in (75 mm)

V5641A-T

Assmann Wsw Components

Heat Sink

Aluminium Alloy

Transistor

Folded Back

21 Ω

0.252 in (6.4 mm)

0.878 in (22.3 mm)

Anodized

Black

1.409 in (35.8 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.