Omnidirectional Heat Sinks 20

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Part RoHS Manufacturer Thermal Device Type Profile Body Material Device Used On Construction Fin Orientation Thermal Resistance Approvals (V) Height Width Finish Diameter Color Additional Features Packing Method Weight Length Power (Rated)

630-45AB

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.449 in (11.4 mm)

1.378 in (35 mm)

Anodized

Black

6.81 g

1.378 in (35 mm)

658-35AB-T4

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.35 in (8.89 mm)

1.21 in (30.73 mm)

Anodized

Black

1.21 in (30.73 mm)

680-125220

Wakefield-vette

Heat Sink

Aluminium

Omnidirectional

1.252 in (31.8 mm)

1.811 in (46 mm)

Anodized

Black

49.9 g

1.811 in (46 mm)

680-5A

Wakefield-vette

Heat Sink

Aluminium

Omnidirectional

0.5 in (12.7 mm)

1.811 in (46 mm)

Anodized

Black

31.75 g

1.811 in (46 mm)

ATS-1039-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ATS-1039-C2-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.591 in (15 mm)

1.575 in (40 mm)

Anodized

Green

2.087 in (53 mm)

ATS-1042-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Flared

Omnidirectional

0.591 in (15 mm)

1.614 in (41 mm)

Anodized

Green

2.52 in (64 mm)

ATS-1042-C2-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Flared

Omnidirectional

0.591 in (15 mm)

1.614 in (41 mm)

Anodized

Green

2.52 in (64 mm)

ATS-X50400B-C1-R0

Advanced Thermal Solutions

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.295 in (7.5 mm)

1.575 in (40 mm)

Anodized

Blue

1.575 in (40 mm)

FA-T220-25E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1 in (25.4 mm)

0.984 in (25 mm)

Anodized

Black

17.5 g

1.638 in (41.6 mm)

FA-T220-38E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1.5 in (38.1 mm)

0.984 in (25 mm)

Anodized

Black

27 g

1.638 in (41.6 mm)

FA-T220-51E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

2 in (50.8 mm)

0.984 in (25 mm)

Anodized

Black

37 g

1.638 in (41.6 mm)

FA-T220-64E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

2.5 in (63.5 mm)

0.984 in (25 mm)

Anodized

Black

46 g

1.638 in (41.6 mm)

RA-T2X-25E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1 in (25.4 mm)

0.984 in (25 mm)

Anodized

Black

25 g

1.654 in (42 mm)

RA-T2X-38E

Ohmite Manufacturing

Heat Sink

Aluminium

Omnidirectional

1.5 in (38.1 mm)

0.984 in (25 mm)

Anodized

Black

38 g

1.654 in (42 mm)

658-60AB-T3

Wakefield-vette

Heat Sink

Pin Fin Array

Fin

Omnidirectional

0.598 in (15.2 mm)

1.098 in (27.9 mm)

Anodized

Black

14.17 g

1.098 in (27.9 mm)

625-25AB-T4E

Wakefield-vette

Heat Sink

Pin Fin Array

Aluminium

Fin

Omnidirectional

0.252 in (6.4 mm)

0.984 in (25 mm)

Anodized

Black

5.45 g

0.984 in (25 mm)

7G0020A

TDK

Heat Sink

Converter

Fin Pin

Omnidirectional

10 Ω

0.22 in (5.6 mm)

0.953 in (24.2 mm)

9.49 g

1.961 in (49.8 mm)

7G0011A

TDK

Heat Sink

Converter

Fin Pin

Omnidirectional

8.24 Ω

0.224 in (5.7 mm)

1.472 in (37.4 mm)

14.6 g

1.969 in (50 mm)

HAF-15T

TDK

Heat Sink

Converter

Fin Pin

Omnidirectional

1.5 Ω

1.5 in (38.1 mm)

2.402 in (61 mm)

250 g

4.598 in (116.8 mm)

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.