| Part | RoHS | Manufacturer | Thermal Device Type | Profile | Body Material | Device Used On | Construction | Fin Orientation | Thermal Resistance | Approvals (V) | Height | Width | Finish | Diameter | Color | Additional Features | Packing Method | Weight | Length | Power (Rated) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
TE Connectivity |
Heat Sink |
Clip/Screw |
Aluminium Alloy |
Fin |
Longitudinal |
0.404 in (10.27 mm) |
3.37 in (85.6 mm) |
Anodized |
4.39 in (111.5 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.449 in (11.4 mm) |
1.378 in (35 mm) |
Anodized |
Black |
6.81 g |
1.378 in (35 mm) |
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|
Wakefield-vette |
Heat Sink |
Adhesive |
0.35 in (8.9 mm) |
1.378 in (35 mm) |
12.26 g |
1.378 in (35 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Extruded |
1 in (25.4 mm) |
1 in (25.4 mm) |
24.95 g |
1.65 in (41.9 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.35 in (8.89 mm) |
1.21 in (30.73 mm) |
Anodized |
Black |
1.21 in (30.73 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Aluminium |
Omnidirectional |
1.252 in (31.8 mm) |
1.811 in (46 mm) |
Anodized |
Black |
49.9 g |
1.811 in (46 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Aluminium |
Omnidirectional |
0.5 in (12.7 mm) |
1.811 in (46 mm) |
Anodized |
Black |
31.75 g |
1.811 in (46 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.591 in (15 mm) |
1.575 in (40 mm) |
Anodized |
Green |
2.087 in (53 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Flared |
Omnidirectional |
0.591 in (15 mm) |
1.614 in (41 mm) |
Anodized |
Green |
2.52 in (64 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Flared |
Omnidirectional |
0.591 in (15 mm) |
1.614 in (41 mm) |
Anodized |
Green |
2.52 in (64 mm) |
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|
Advanced Thermal Solutions |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.295 in (7.5 mm) |
1.575 in (40 mm) |
Anodized |
Blue |
1.575 in (40 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
17.5 g |
1.638 in (41.6 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
27 g |
1.638 in (41.6 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2 in (50.8 mm) |
0.984 in (25 mm) |
Anodized |
Black |
37 g |
1.638 in (41.6 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
2.5 in (63.5 mm) |
0.984 in (25 mm) |
Anodized |
Black |
46 g |
1.638 in (41.6 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1 in (25.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
25 g |
1.654 in (42 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Omnidirectional |
1.5 in (38.1 mm) |
0.984 in (25 mm) |
Anodized |
Black |
38 g |
1.654 in (42 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium |
Transistor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Anodized |
Black |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
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|
|
Ohmite Manufacturing |
Heat Sink |
Aluminium Alloy |
Semiconductor |
Extruded |
Fin Pin |
0.4 in (10.16 mm) |
0.5 in (12.7 mm) |
Bulk |
3.8 g |
1.02 in (25.91 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Fin |
Omnidirectional |
0.598 in (15.2 mm) |
1.098 in (27.9 mm) |
Anodized |
Black |
14.17 g |
1.098 in (27.9 mm) |
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|
|
Wakefield Thermal Solutions |
Heat Sink |
U |
Aluminium |
0.339 in (8.6 mm) |
0.252 in (6.4 mm) |
Anodized |
Black |
820 mg |
0.5 in (12.7 mm) |
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|
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
1.5 in (38.1 mm) |
2 in (50.8 mm) |
Anodized |
Black |
60.33 g |
2 in (50.8 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Extruded |
2.626 in (66.7 mm) |
4.752 in (120.7 mm) |
285.77 g |
3 in (76.2 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Extruded |
2.626 in (66.7 mm) |
4.752 in (120.7 mm) |
530.71 g |
5.52 in (140.2 mm) |
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|
Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.409 in (61.2 mm) |
7.2 in (182.88 mm) |
3 in (76.2 mm) |
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|
Wakefield-vette |
Heat Sink |
Fin |
Longitudinal |
2.35 in (59.7 mm) |
7.2 in (182.88 mm) |
9 in (228.6 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Aluminium |
Extruded |
0.24 in (6.1 mm) |
2.28 in (57.9 mm) |
Anodized |
Black |
2.402 in (61 mm) |
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|
|
Wakefield-vette |
Heat Sink |
Pin Fin Array |
Aluminium |
Fin |
Omnidirectional |
0.252 in (6.4 mm) |
0.984 in (25 mm) |
Anodized |
Black |
5.45 g |
0.984 in (25 mm) |
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|
Crydom |
Heat Sink |
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|
Advanced Thermal Solutions |
Heat Sink |
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|
|
Advanced Thermal Solutions |
Heat Sink |
Chromate |
Extruded |
Longitudinal |
0.902 in (22.9 mm) |
2.323 in (59 mm) |
Gold Anodized |
Maxiflow, Device Used On: Half Brick DC-DC Converter |
2.402 in (61 mm) |
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|
Cts |
Heat Sink |
Screw |
Transistor |
U |
Transverse |
14.4 Ω |
2.18 in (55.37 mm) |
0.5 in (12.7 mm) |
Black |
1.38 in (35.05 mm) |
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|
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium, Cold-Forged Aluminium |
Transceiver |
Pin Fin |
15 W |
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|
|
TE Connectivity |
Heat Sink |
Clip |
Aluminium |
IC |
Radial |
UL |
15 W |
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|
Advanced Thermal Solutions |
Heat Sink |
|||||||||||||||||||
|
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
12.93 Ω |
0.906 in (23 mm) |
1.063 in (27 mm) |
Black Anodized |
1.063 in (27 mm) |
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|
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.827 in (21 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
||||||||
|
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
12.02 Ω |
0.906 in (23 mm) |
1.22 in (31 mm) |
Black Anodized |
1.22 in (31 mm) |
||||||||
|
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
10.03 Ω |
0.472 in (12 mm) |
1.378 in (35 mm) |
Black Anodized |
1.378 in (35 mm) |
||||||||
|
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Elliptical Fin |
9.95 Ω |
0.906 in (23 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
|
Wakefield Thermal Solutions |
Heat Sink |
Clip |
Aluminium Alloy |
IC |
Extruded |
Pin Fin |
9.18 Ω |
0.472 in (12 mm) |
1.575 in (40 mm) |
Black Anodized |
1.575 in (40 mm) |
||||||||
|
|
Ohmite Manufacturing |
Heat Sink |
||||||||||||||||||
|
Vicor |
Heat Sink |
Aluminium Alloy |
Extruded |
0.909 in (23.1 mm) |
2.22 in (56.4 mm) |
2.28 in (57.9 mm) |
||||||||||||||
|
Cts |
Heat Sink |
Adhesive |
Aluminium Alloy |
IC |
9.9 Ω |
0.5 in (12.7 mm) |
1.575 in (40 mm) |
Anodized |
Black |
1.575 in (40 mm) |
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|
|
Assmann Wsw Components |
Heat Sink |
||||||||||||||||||
|
|
Assmann Wsw Components |
Heat Sink |
Aluminium |
Longitudinal |
12 Ω |
0.472 in (12 mm) |
0.787 in (20 mm) |
Black Anodized |
Black |
1.142 in (29 mm) |
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|
|
CUI Devices |
Heat Sink |
Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.
Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.
Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.
Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.
However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.