MT29F8G16ABACAH4:C by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	MT29F8G16ABACAH4:C
Description	FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words: 536870912 words;
Datasheet	MT29F8G16ABACAH4:C Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.0001 Amp
Organization:	512MX16
Programming Voltage (V):	3.3
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	35 mA
Command User Interface:	YES
No. of Terminals:	63
No. of Words:	536870912 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B63
No. of Sectors/Size:	4K
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	FBGA
Other Names:	125911 -MT29F8G16ABACAH4:C
Memory Density:	8589934592 bit
Sector Size (Words):	128K
Toggle Bit:	NO
Memory IC Type:	FLASH
Minimum Operating Temperature:	0 Cel
Memory Width:	16
Page Size (words):	2K
Type:	SLC NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA63,10X12,32
Maximum Access Time:	25 ns
No. of Words Code:	512M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Data Polling:	NO
Power Supplies (V):	3/3.3

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