N25Q00AA11G1240E by Micron Technology | Memory ICs

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Manufacturer	Micron Technology
Manufacturer's Part Number	N25Q00AA11G1240E
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: LBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;
Datasheet	N25Q00AA11G1240E Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	1GX1
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.3 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals:	24
Maximum Clock Frequency (fCLK):	108 MHz
No. of Words:	1073741824 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B24
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	LBGA
Width:	6 mm
Memory Density:	1073741824 bit
Memory IC Type:	FLASH
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	1
No. of Functions:	1
Type:	NOR TYPE
Length:	8 mm
No. of Words Code:	1G
Nominal Supply Voltage / Vsup (V):	1.8
Peak Reflow Temperature (C):	260
Parallel or Serial:	SERIAL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2 V

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