NXP Semiconductors - LPC1110FD20,529

LPC1110FD20,529 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number LPC1110FD20,529
Description MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet LPC1110FD20,529 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.8 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.65 mm
Sub-Category: Microcontrollers
Surface Mount: YES
ADC Channels: YES
No. of Terminals: 20
DMA Channels: NO
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
No. of I/O Lines: 16
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: R-PDSO-G20
Maximum Clock Frequency: 25 MHz
Package Shape: RECTANGULAR
ROM Words: 4096
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: SOP
Width: 7.5 mm
Moisture Sensitivity Level (MSL): 2
Other Names: 935297015529
NXPNXPLPC1110FD20529
568-10324-5
LPC1110FD20,529-ND
2156-LPC1110FD20,529
Data EEPROM Size: 0
Speed: 50 rpm
Peripheral IC Type: MICROCONTROLLER, RISC
Maximum Supply Voltage: 3.6 V
RAM Bytes: 1024
External Data Bus Width: 0
Peripherals: BOD, POR, TIMER(5), WDT
Bit Size: 32
DAC Channels: NO
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: SOP20,.4
Length: 7.5 mm
PWM Channels: NO
On Chip Program ROM Width: 8
Connectivity: I2C, SPI, UART
Peak Reflow Temperature (C): 260
ROM Programmability: FLASH
Analog To Digital Convertors: 5-Ch 10-Bit
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
CPU Family: CORTEX-M0
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